Electrochemical analysis of zincate treatments for Al and Al alloy films

Mikiko Saito; Takeyuki Maegawa; Takayuki Homma

doi:10.1016/j.electacta.2005.05.063

Electrochemical analysis of zincate treatments for Al and Al alloy films

Mikiko Saito^*, Takeyuki Maegawa, Takayuki Homma

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

17 Citations (Scopus)

Abstract

Electrochemical behavior of Al and Al alloy films in zincate solution was investigated to elucidate the effect of the zincate pretreatment for electroless NiP deposition, which is used for under bump metallization for LSI interconnects. The immersion potential for AlCu and AlSiCu, immediately reached to constant, which was almost equal potential to zinc reference electrode. The corrosion current for the AlCu and AlSiCu films was larger than that of the Al and AlSi films in the zincate solution. It was also confirmed that the deposited Zn at the surface of AlCu and AlSiCu films possessed smaller grain size and larger amount of nucleation, resulted in the formation of flat NiP films.

Original language	English
Pages (from-to)	1017-1020
Number of pages	4
Journal	Electrochimica Acta
Volume	51
Issue number	5
DOIs	https://doi.org/10.1016/j.electacta.2005.05.063
Publication status	Published - 2005 Nov 10

Keywords

Al alloy films
Immersion potential
Under bump metallization
Zincate treatment

ASJC Scopus subject areas

Chemical Engineering(all)
Electrochemistry

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10.1016/j.electacta.2005.05.063

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abstract = "Electrochemical behavior of Al and Al alloy films in zincate solution was investigated to elucidate the effect of the zincate pretreatment for electroless NiP deposition, which is used for under bump metallization for LSI interconnects. The immersion potential for AlCu and AlSiCu, immediately reached to constant, which was almost equal potential to zinc reference electrode. The corrosion current for the AlCu and AlSiCu films was larger than that of the Al and AlSi films in the zincate solution. It was also confirmed that the deposited Zn at the surface of AlCu and AlSiCu films possessed smaller grain size and larger amount of nucleation, resulted in the formation of flat NiP films.",

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T1 - Electrochemical analysis of zincate treatments for Al and Al alloy films

AU - Saito, Mikiko

AU - Maegawa, Takeyuki

AU - Homma, Takayuki

PY - 2005/11/10

Y1 - 2005/11/10

N2 - Electrochemical behavior of Al and Al alloy films in zincate solution was investigated to elucidate the effect of the zincate pretreatment for electroless NiP deposition, which is used for under bump metallization for LSI interconnects. The immersion potential for AlCu and AlSiCu, immediately reached to constant, which was almost equal potential to zinc reference electrode. The corrosion current for the AlCu and AlSiCu films was larger than that of the Al and AlSi films in the zincate solution. It was also confirmed that the deposited Zn at the surface of AlCu and AlSiCu films possessed smaller grain size and larger amount of nucleation, resulted in the formation of flat NiP films.

AB - Electrochemical behavior of Al and Al alloy films in zincate solution was investigated to elucidate the effect of the zincate pretreatment for electroless NiP deposition, which is used for under bump metallization for LSI interconnects. The immersion potential for AlCu and AlSiCu, immediately reached to constant, which was almost equal potential to zinc reference electrode. The corrosion current for the AlCu and AlSiCu films was larger than that of the Al and AlSi films in the zincate solution. It was also confirmed that the deposited Zn at the surface of AlCu and AlSiCu films possessed smaller grain size and larger amount of nucleation, resulted in the formation of flat NiP films.

KW - Al alloy films

KW - Immersion potential

KW - Under bump metallization

KW - Zincate treatment

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M3 - Article

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VL - 51

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JO - Electrochimica Acta

JF - Electrochimica Acta

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Electrochemical analysis of zincate treatments for Al and Al alloy films

Abstract

Keywords

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