Electrochemical analysis of zincate treatments for Al and Al alloy films

Mikiko Saito*, Takeyuki Maegawa, Takayuki Homma

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)


Electrochemical behavior of Al and Al alloy films in zincate solution was investigated to elucidate the effect of the zincate pretreatment for electroless NiP deposition, which is used for under bump metallization for LSI interconnects. The immersion potential for AlCu and AlSiCu, immediately reached to constant, which was almost equal potential to zinc reference electrode. The corrosion current for the AlCu and AlSiCu films was larger than that of the Al and AlSi films in the zincate solution. It was also confirmed that the deposited Zn at the surface of AlCu and AlSiCu films possessed smaller grain size and larger amount of nucleation, resulted in the formation of flat NiP films.

Original languageEnglish
Pages (from-to)1017-1020
Number of pages4
JournalElectrochimica Acta
Issue number5
Publication statusPublished - 2005 Nov 10


  • Al alloy films
  • Immersion potential
  • Under bump metallization
  • Zincate treatment

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Electrochemistry


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