@inproceedings{d4749a87f5f64eefbab19782552a1072,
title = "Electrochemical evaluation and finite element structure analysis of Si wafer surface under mechanical stress",
abstract = "The effect of mechanical strain on the surface properties of Si wafer was investigated as a model experiment to evaluate the correlation between the degree of the strain and the electrochemical properties of the Si wafer surface. Finite element structure analysis was applied to estimate the degree of strain, and the open circuit potential measurement was carried out to investigate the surface electrochemical property. The results of these experiments suggested that the mechanical stress induces strain to the Si crystal structure to change the surface reactivity.",
author = "K. Sakata and T. Homma",
year = "2009",
doi = "10.1149/1.3108356",
language = "English",
isbn = "9781615673124",
series = "ECS Transactions",
number = "40",
pages = "79--86",
booktitle = "ECS Transactions - Solid State - General - 214th ECS Meeting/RRiME 2008",
edition = "40",
note = "Solid State - General - 214th ECS Meeting/RRiME 2008 ; Conference date: 12-10-2008 Through 17-10-2008",
}