Electromagnetic analysis on magnetic field and current distribution in high temperature superconducting thin tape in coil winding

Hiroshi Ueda; Seok Beom Kim; So Noguchi; Atsushi Ishiyama; Hiroshi Miyazaki; Sadanori Iwai; Taizo Tosaka; Shunji Nomura; Tsutomu Kurusu; Shinichi Urayama; Hidenao Fukuyama

doi:10.1109/CEFC.2016.7816041

Electromagnetic analysis on magnetic field and current distribution in high temperature superconducting thin tape in coil winding

Hiroshi Ueda, Seok Beom Kim, So Noguchi, Atsushi Ishiyama, Hiroshi Miyazaki, Sadanori Iwai, Taizo Tosaka, Shunji Nomura, Tsutomu Kurusu, Shinichi Urayama, Hidenao Fukuyama

School of Advanced Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

High temperature superconducting (HTS) wires are high aspect ratio cross-section tapes. Therefore, the applications of HTS tapes lead to various problems such as AC loss, non-uniform current, and screening current. In practice, we must investigate the detail of current distribution in HTS tapes using the electromagnetic analysis technique dealing with high aspect ratio tape and nonlinearity of superconductor. We developed the numerical simulation code of electromagnetic field analysis in HTS tape using a finite element method (FEM) and fast multipole method (FMM).

Original language	English
Title of host publication	IEEE CEFC 2016 - 17th Biennial Conference on Electromagnetic Field Computation
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781509010325
DOIs	https://doi.org/10.1109/CEFC.2016.7816041
Publication status	Published - 2017 Jan 12
Event	17th Biennial IEEE Conference on Electromagnetic Field Computation, IEEE CEFC 2016 - Miami, United States Duration: 2016 Nov 13 → 2016 Nov 16

Other

Other	17th Biennial IEEE Conference on Electromagnetic Field Computation, IEEE CEFC 2016
Country/Territory	United States
City	Miami
Period	16/11/13 → 16/11/16

Keywords

High temperature superconducting coil
Irregular field
Screening current
Temporal stability
Thin tape

ASJC Scopus subject areas

Computational Mathematics
Instrumentation
Electrical and Electronic Engineering

Access to Document

10.1109/CEFC.2016.7816041

Cite this

Ueda, H., Kim, S. B., Noguchi, S., Ishiyama, A., Miyazaki, H., Iwai, S., Tosaka, T., Nomura, S., Kurusu, T., Urayama, S., & Fukuyama, H. (2017). Electromagnetic analysis on magnetic field and current distribution in high temperature superconducting thin tape in coil winding. In IEEE CEFC 2016 - 17th Biennial Conference on Electromagnetic Field Computation Article 7816041 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CEFC.2016.7816041

Electromagnetic analysis on magnetic field and current distribution in high temperature superconducting thin tape in coil winding. / Ueda, Hiroshi; Kim, Seok Beom; Noguchi, So et al.
IEEE CEFC 2016 - 17th Biennial Conference on Electromagnetic Field Computation. Institute of Electrical and Electronics Engineers Inc., 2017. 7816041.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ueda, H, Kim, SB, Noguchi, S, Ishiyama, A, Miyazaki, H, Iwai, S, Tosaka, T, Nomura, S, Kurusu, T, Urayama, S & Fukuyama, H 2017, Electromagnetic analysis on magnetic field and current distribution in high temperature superconducting thin tape in coil winding. in IEEE CEFC 2016 - 17th Biennial Conference on Electromagnetic Field Computation., 7816041, Institute of Electrical and Electronics Engineers Inc., 17th Biennial IEEE Conference on Electromagnetic Field Computation, IEEE CEFC 2016, Miami, United States, 16/11/13. https://doi.org/10.1109/CEFC.2016.7816041

Ueda H, Kim SB, Noguchi S, Ishiyama A, Miyazaki H, Iwai S et al. Electromagnetic analysis on magnetic field and current distribution in high temperature superconducting thin tape in coil winding. In IEEE CEFC 2016 - 17th Biennial Conference on Electromagnetic Field Computation. Institute of Electrical and Electronics Engineers Inc. 2017. 7816041 doi: 10.1109/CEFC.2016.7816041

@inproceedings{547a308b9dae4b7eab57cfe812ad6467,

title = "Electromagnetic analysis on magnetic field and current distribution in high temperature superconducting thin tape in coil winding",

abstract = "High temperature superconducting (HTS) wires are high aspect ratio cross-section tapes. Therefore, the applications of HTS tapes lead to various problems such as AC loss, non-uniform current, and screening current. In practice, we must investigate the detail of current distribution in HTS tapes using the electromagnetic analysis technique dealing with high aspect ratio tape and nonlinearity of superconductor. We developed the numerical simulation code of electromagnetic field analysis in HTS tape using a finite element method (FEM) and fast multipole method (FMM).",

keywords = "High temperature superconducting coil, Irregular field, Screening current, Temporal stability, Thin tape",

author = "Hiroshi Ueda and Kim, {Seok Beom} and So Noguchi and Atsushi Ishiyama and Hiroshi Miyazaki and Sadanori Iwai and Taizo Tosaka and Shunji Nomura and Tsutomu Kurusu and Shinichi Urayama and Hidenao Fukuyama",

year = "2017",

month = jan,

day = "12",

doi = "10.1109/CEFC.2016.7816041",

language = "English",

booktitle = "IEEE CEFC 2016 - 17th Biennial Conference on Electromagnetic Field Computation",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

address = "United States",

note = "17th Biennial IEEE Conference on Electromagnetic Field Computation, IEEE CEFC 2016 ; Conference date: 13-11-2016 Through 16-11-2016",

}

TY - GEN

T1 - Electromagnetic analysis on magnetic field and current distribution in high temperature superconducting thin tape in coil winding

AU - Ueda, Hiroshi

AU - Kim, Seok Beom

AU - Noguchi, So

AU - Ishiyama, Atsushi

AU - Miyazaki, Hiroshi

AU - Iwai, Sadanori

AU - Tosaka, Taizo

AU - Nomura, Shunji

AU - Kurusu, Tsutomu

AU - Urayama, Shinichi

AU - Fukuyama, Hidenao

PY - 2017/1/12

Y1 - 2017/1/12

N2 - High temperature superconducting (HTS) wires are high aspect ratio cross-section tapes. Therefore, the applications of HTS tapes lead to various problems such as AC loss, non-uniform current, and screening current. In practice, we must investigate the detail of current distribution in HTS tapes using the electromagnetic analysis technique dealing with high aspect ratio tape and nonlinearity of superconductor. We developed the numerical simulation code of electromagnetic field analysis in HTS tape using a finite element method (FEM) and fast multipole method (FMM).

AB - High temperature superconducting (HTS) wires are high aspect ratio cross-section tapes. Therefore, the applications of HTS tapes lead to various problems such as AC loss, non-uniform current, and screening current. In practice, we must investigate the detail of current distribution in HTS tapes using the electromagnetic analysis technique dealing with high aspect ratio tape and nonlinearity of superconductor. We developed the numerical simulation code of electromagnetic field analysis in HTS tape using a finite element method (FEM) and fast multipole method (FMM).

KW - High temperature superconducting coil

KW - Irregular field

KW - Screening current

KW - Temporal stability

KW - Thin tape

UR - http://www.scopus.com/inward/record.url?scp=85012009163&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85012009163&partnerID=8YFLogxK

U2 - 10.1109/CEFC.2016.7816041

DO - 10.1109/CEFC.2016.7816041

M3 - Conference contribution

AN - SCOPUS:85012009163

BT - IEEE CEFC 2016 - 17th Biennial Conference on Electromagnetic Field Computation

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 17th Biennial IEEE Conference on Electromagnetic Field Computation, IEEE CEFC 2016

Y2 - 13 November 2016 through 16 November 2016

ER -

Electromagnetic analysis on magnetic field and current distribution in high temperature superconducting thin tape in coil winding

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Keywords

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