Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection

Masaki Ohyama, Masatsugu Nimura, Jun Mizuno*, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

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Engineering