Evaluation of Thermal Contact Resistance Between Two Solid Surfaces Using Photoacoustic Technique

Kakeru Kagata*, Kyohei Kageyama, Shinichi Kinoshita, Atsumasa Yoshida

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)


Thermal contact resistance is one of the factors that complicates heat transfer between the interfaces of different components. Because heat transfer is influenced by several factors, it is difficult to estimate all the influencing factors for practical applications. In this study, the thermal contact resistance between two solid surfaces was evaluated using the photoacoustic (PA) technique. The samples consisted of a metal foil and metal cylinders, which had various surface roughnesses at the contact faces measured at the same contact pressure. A one-dimensional analytical solution of the phase lag of the PA signal showed a similar trend with the experimental results. However, there were some quantitative differences between the two groups. By comparing the numerical calculation results for the developed heat conduction model of a cylindrical coordinate system with the experimental results, we found that the in-plane distribution of thermal contact resistance at the contact face contributed to the deviation between the experimental results and the numerical results. The thermal contact resistance was evaluated by considering the in-plane distribution of the thermal contact resistance, and reasonable values of thermal contact resistance were obtained.

Original languageEnglish
Article number131
JournalInternational Journal of Thermophysics
Issue number9
Publication statusPublished - 2020 Sept 1
Externally publishedYes


  • In-plane distribution
  • Phase lag
  • Photoacoustic technique
  • Sensing technology
  • Thermal contact resistance

ASJC Scopus subject areas

  • Condensed Matter Physics


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