TY - GEN
T1 - Evaluations of low temperature bonding using Au sub-micron particles for wafer level MEMS packaging
AU - Ito, S.
AU - Ogashiwa, T.
AU - Kanehira, Y.
AU - Ishida, H.
AU - Shoji, S.
AU - Mizuno, J.
PY - 2011/12/1
Y1 - 2011/12/1
N2 - This paper describes wafer level vacuum packaging with sub-micron Au particles for MEMS (micro electro mechanical systems) applications. Low temperature bonding is indispensable for relevant MEMS packaging, and use of sub-micron Au particles are suitable for hermetic seal bonding. For the fabrication of hermetically sealed wafer level packaging, a base silicon wafer and a cap glass wafer were bonded at around 200°C. Before bonding, the surface of seal rings was observed with a laser microscope to investigate the effect of surface roughness for hermeticity. After bonding, bonded wafers were dipped in the hydrofluoroether for 30 min. As a result, surface flatness of Au particles contributed to achieve hermetic sealing. Double seal rings structures were also useful to realize hermetic sealing.
AB - This paper describes wafer level vacuum packaging with sub-micron Au particles for MEMS (micro electro mechanical systems) applications. Low temperature bonding is indispensable for relevant MEMS packaging, and use of sub-micron Au particles are suitable for hermetic seal bonding. For the fabrication of hermetically sealed wafer level packaging, a base silicon wafer and a cap glass wafer were bonded at around 200°C. Before bonding, the surface of seal rings was observed with a laser microscope to investigate the effect of surface roughness for hermeticity. After bonding, bonded wafers were dipped in the hydrofluoroether for 30 min. As a result, surface flatness of Au particles contributed to achieve hermetic sealing. Double seal rings structures were also useful to realize hermetic sealing.
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U2 - 10.1109/ISAPM.2011.6105749
DO - 10.1109/ISAPM.2011.6105749
M3 - Conference contribution
AN - SCOPUS:84856459446
SN - 9781467301473
T3 - Proceedings - International Symposium on Advanced Packaging Materials
SP - 342
EP - 347
BT - APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials
T2 - 2011 International Symposium on Advanced Packaging Materials, APM 2011
Y2 - 25 October 2011 through 28 October 2011
ER -