Evidence for "superfilling" of submicrometer trenches with electroless copper deposit

Madoka Hasegawa; Noriyuki Yamachika; Yosi Shacham-Diamand; Yutaka Okinaka; Tetsuya Osaka

doi:10.1063/1.2712505

Evidence for "superfilling" of submicrometer trenches with electroless copper deposit

Madoka Hasegawa^*, Noriyuki Yamachika, Yosi Shacham-Diamand, Yutaka Okinaka, Tetsuya Osaka

^*Corresponding author for this work

Research Organization for Nano & Life Innovation

Research output: Contribution to journal › Article › peer-review

40 Citations (Scopus)

Abstract

Void-free copper filling of trenches for ultralarge scale integrated interconnect structure was demonstrated by electroless deposition technique using polyethylene glycol as an inhibiting bath additive. With this electroless plating bath, the authors succeeded in demonstrating superfilling. Of particular interest is that the deposition at trench opening was nil during the filling process, while that at the bottom was very fast. This letter presents a demonstration and a proof of superfilling of trenches by electroless copper deposition.

Original language	English
Article number	101916
Journal	Applied Physics Letters
Volume	90
Issue number	10
DOIs	https://doi.org/10.1063/1.2712505
Publication status	Published - 2007

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

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10.1063/1.2712505

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abstract = "Void-free copper filling of trenches for ultralarge scale integrated interconnect structure was demonstrated by electroless deposition technique using polyethylene glycol as an inhibiting bath additive. With this electroless plating bath, the authors succeeded in demonstrating superfilling. Of particular interest is that the deposition at trench opening was nil during the filling process, while that at the bottom was very fast. This letter presents a demonstration and a proof of superfilling of trenches by electroless copper deposition.",

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AU - Shacham-Diamand, Yosi

AU - Okinaka, Yutaka

AU - Osaka, Tetsuya

N1 - Funding Information: This work was supported by the 21st Century COE Program of the Center for Practical Nano-Chemistry and by the Encouraging Development of Strategic Research Centers Program of the Consolidated Research Institute for Advanced Science and Medical Care, both granted by the MEXT, Japan.

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Y1 - 2007

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AB - Void-free copper filling of trenches for ultralarge scale integrated interconnect structure was demonstrated by electroless deposition technique using polyethylene glycol as an inhibiting bath additive. With this electroless plating bath, the authors succeeded in demonstrating superfilling. Of particular interest is that the deposition at trench opening was nil during the filling process, while that at the bottom was very fast. This letter presents a demonstration and a proof of superfilling of trenches by electroless copper deposition.

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Evidence for "superfilling" of submicrometer trenches with electroless copper deposit

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