Experimental development of a foot mechanism with shock absorbing material for acquisition of landing surface position information and stabilization of dynamic biped walking

Jin'ichi Yamaguchi*, Atsuo Takanishi, Ichiro Kato

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

68 Citations (Scopus)

Abstract

As the first stage of dynamic biped walking adapting to an unknown uneven surface using an anthropomorphic biped walking robot, this paper introduces a special foot mechanism with shock absorbing material that stabilizes dynamic biped walking and acquires position information on the landing surface. The new foot has three functions: (1) a function to obtain information on the position relative to a landing surface; (2) a function to absorb the shock of the foot landing; (3) a function to stabilize changes in the support leg. Two units of the foot mechanism were produced, a biped walking robot WL-12RVI that had the foot mechanism installed inside it was developed, and a walking experiment with WL-12RVI was performed. As a result, decreased vibration around the pitch axis, decreased torque demands on ankle actuators on the pitch axis, increased dynamic biped walking success probability, and acquired landing surface information were achieved.

Original languageEnglish
Title of host publicationProceedings - IEEE International Conference on Robotics and Automation
Pages2892-2899
Number of pages8
DOIs
Publication statusPublished - 1995 Jan 1
EventProceedings of the 1995 IEEE International Conference on Robotics and Automation. Part 1 (of 3) - Nagoya, Jpn
Duration: 1995 May 211995 May 27

Publication series

NameProceedings - IEEE International Conference on Robotics and Automation
Volume3
ISSN (Print)1050-4729

Other

OtherProceedings of the 1995 IEEE International Conference on Robotics and Automation. Part 1 (of 3)
CityNagoya, Jpn
Period95/5/2195/5/27

ASJC Scopus subject areas

  • Software
  • Control and Systems Engineering
  • Artificial Intelligence
  • Electrical and Electronic Engineering

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