Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding

Hidetoshi Shinohara; Jun Mizuno; Fumihiko Kitagawa; Koji Otsuka; Shuichi Shoji

Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding

Hidetoshi Shinohara, Jun Mizuno, Fumihiko Kitagawa, Koji Otsuka, Shuichi Shoji

Research output: Contribution to conference › Paper › peer-review

Abstract

In this paper, a PMMA (poly-methyl methacrylate) microchip, which has shallow dams of about 5 μm gaps, was fabricated and evaluated. Accurate dimension control of the micro-channels was realized by not only optimizing hot embossing conditions but also employing low temperature plasma activated bonding.

Original language	English
Pages	158-160
Number of pages	3
Publication status	Published - 2006 Jan 1
Event	10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006 - Tokyo, Japan Duration: 2006 Nov 5 → 2006 Nov 9

Conference

Conference	10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006
Country/Territory	Japan
City	Tokyo
Period	06/11/5 → 06/11/9

Keywords

Hot embossing
Polymer microchip
Surface activation bonding

ASJC Scopus subject areas

Chemical Engineering (miscellaneous)
Bioengineering

Cite this

Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding. / Shinohara, Hidetoshi; Mizuno, Jun; Kitagawa, Fumihiko et al.
2006. 158-160 Paper presented at 10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006, Tokyo, Japan.

Research output: Contribution to conference › Paper › peer-review

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title = "Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding",

abstract = "In this paper, a PMMA (poly-methyl methacrylate) microchip, which has shallow dams of about 5 μm gaps, was fabricated and evaluated. Accurate dimension control of the micro-channels was realized by not only optimizing hot embossing conditions but also employing low temperature plasma activated bonding.",

keywords = "Hot embossing, Polymer microchip, Surface activation bonding",

author = "Hidetoshi Shinohara and Jun Mizuno and Fumihiko Kitagawa and Koji Otsuka and Shuichi Shoji",

year = "2006",

month = jan,

day = "1",

language = "English",

pages = "158--160",

note = "10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006 ; Conference date: 05-11-2006 Through 09-11-2006",

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T1 - Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding

AU - Shinohara, Hidetoshi

AU - Mizuno, Jun

AU - Kitagawa, Fumihiko

AU - Otsuka, Koji

AU - Shoji, Shuichi

PY - 2006/1/1

Y1 - 2006/1/1

N2 - In this paper, a PMMA (poly-methyl methacrylate) microchip, which has shallow dams of about 5 μm gaps, was fabricated and evaluated. Accurate dimension control of the micro-channels was realized by not only optimizing hot embossing conditions but also employing low temperature plasma activated bonding.

AB - In this paper, a PMMA (poly-methyl methacrylate) microchip, which has shallow dams of about 5 μm gaps, was fabricated and evaluated. Accurate dimension control of the micro-channels was realized by not only optimizing hot embossing conditions but also employing low temperature plasma activated bonding.

KW - Hot embossing

KW - Polymer microchip

KW - Surface activation bonding

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UR - http://www.scopus.com/inward/citedby.url?scp=84902472451&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:84902472451

SP - 158

EP - 160

T2 - 10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006

Y2 - 5 November 2006 through 9 November 2006

ER -

Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding

Abstract

Conference

Keywords

ASJC Scopus subject areas

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