Fabrication of low-resonant-frequency inertial MEMS using through-silicon DRIE applied to silicon-on-glass

Jun Wu*, Hui Zhang, Tamio Ikehashi*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

This paper reports on a fabrication process suitable for ultra-low resonant frequency inertial MEMS sensors. The low resonant frequency is achieved by electrically tunable springs and a heavy mass formed by through-silicon deep reactive-ion etching (DRIE) applied to a silicon-on-glass. A thermal issue of through-silicon DRIE (TSD) stemming from the low-resonant-frequency structure is circumvented by two methods: introducing cooling time between the DRIE steps, and adopting a metal hard mask. A blade dicing method suited for this process is also presented. To monitor the verticality of TSD, a non-destructive taper detection method that utilizes a capacitance-voltage (CV) curve is proposed and verified.

Original languageEnglish
Article number056501
JournalJapanese journal of applied physics
Volume63
Issue number5
DOIs
Publication statusPublished - 2024 May 1

Keywords

  • DRIE
  • MEMS
  • inertial sensor
  • silicon-on-glass

ASJC Scopus subject areas

  • General Engineering
  • General Physics and Astronomy

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