TY - JOUR
T1 - Fabrication of post-hydrophilic treatment-free plastic biochip using polyurea film
AU - Shinohara, Hidetoshi
AU - Takahashi, Yoshikazu
AU - Mizuno, Jun
AU - Shoji, Shuichi
N1 - Funding Information:
This work is partly supported by a Japan Ministry of Education, Culture, Sports, Science, and Technology Grant-in-Aid for SCOE “ASMeW”, the Ambient SoC Global COE Program of Waseda University, “The Foundation of Technology Promotion of Electronic Circuit Boards,” and Scientific Basic Research (A) No. 19296046.
PY - 2009/9/24
Y1 - 2009/9/24
N2 - A novel low-temperature bonding method was developed by using polyurea film as intermediate layers. A microchip with a microchannel having a highly hydrophilic surface was realized by pretreatment with vacuum ultraviolet light irradiation under an oxygen atmosphere (VUV/O3). The bonding temperature is low enough to use thermo-plastic channel plates such as PMMA (poly(methyl methacrylate)) with negligible deformation of the channel structure. The results of contact angle measurements indicate the highly hydrophilic surface of the microchannel was retained after the bonding process. There was no leakage or obstacles to smooth fluidic flow at the bonded interface. For actual micro-biochip fabrication with this method, the post-hydrophilic treatment after bonding process is unnecessary.
AB - A novel low-temperature bonding method was developed by using polyurea film as intermediate layers. A microchip with a microchannel having a highly hydrophilic surface was realized by pretreatment with vacuum ultraviolet light irradiation under an oxygen atmosphere (VUV/O3). The bonding temperature is low enough to use thermo-plastic channel plates such as PMMA (poly(methyl methacrylate)) with negligible deformation of the channel structure. The results of contact angle measurements indicate the highly hydrophilic surface of the microchannel was retained after the bonding process. There was no leakage or obstacles to smooth fluidic flow at the bonded interface. For actual micro-biochip fabrication with this method, the post-hydrophilic treatment after bonding process is unnecessary.
KW - Bonding
KW - Hydrophilicity
KW - Microchannel
KW - Polyurea
KW - Vacuum ultraviolet
UR - http://www.scopus.com/inward/record.url?scp=69549120564&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=69549120564&partnerID=8YFLogxK
U2 - 10.1016/j.sna.2008.09.001
DO - 10.1016/j.sna.2008.09.001
M3 - Article
AN - SCOPUS:69549120564
SN - 0924-4247
VL - 154
SP - 187
EP - 191
JO - Sensors and Actuators, A: Physical
JF - Sensors and Actuators, A: Physical
IS - 2
ER -