TY - GEN
T1 - Fabrication of the 3-D SU-8 fine micromesh and electroplated Ni micromesh structures
AU - Sato, Hironobu
AU - Houshi, Yoshitaka
AU - Otsuka, Toshiharu
AU - Shoji, Shuichi
PY - 2004/12/1
Y1 - 2004/12/1
N2 - This paper presents fabrication of the 3-D SU-8 fine micromesh structure and electroplated Ni micromesh structure. The SU-8 mesh structures were formed using multiple inclined UV exposure from backside of the SU-8 coated glass substrate with metal patterns. A few μm size pillars and pores were realized by optimizing the UV lithography conditions. The 3-D micromesh Ni structures were also fabricated using electroplating. The inverse-mesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni meshes of about 3μm in diameter were obtained by this method.
AB - This paper presents fabrication of the 3-D SU-8 fine micromesh structure and electroplated Ni micromesh structure. The SU-8 mesh structures were formed using multiple inclined UV exposure from backside of the SU-8 coated glass substrate with metal patterns. A few μm size pillars and pores were realized by optimizing the UV lithography conditions. The 3-D micromesh Ni structures were also fabricated using electroplating. The inverse-mesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni meshes of about 3μm in diameter were obtained by this method.
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M3 - Conference contribution
AN - SCOPUS:23244452218
SN - 4990247205
T3 - Digest of Papers - Microprocesses and Nanotechnology 2004
SP - 304
EP - 305
BT - Digest of Papers - Microprocesses and Nanotechnology 2004
T2 - 2004 International Microprocesses and Nanotechnology Conference
Y2 - 26 October 2004 through 29 October 2004
ER -