@inproceedings{469fca4e133541658cb3ffee85be9545,
title = "Fabrication of Ultra-Low Resonance Frequency Inertial MEMS using Through-Silicon Deep-RIE Applied to Silicon-on-Glass",
abstract = "This paper reports on a fabrication process suitable for low-resonance-frequency inertial MEMS sensors. The low resonance frequency is attained by electrically tunable springs and a large mass formed by a through-silicon Deep-RIE (TSD) applied to a Silicon-on-Glass (SOG). To solve a thermal issue of TSD originating from the low-resonance-frequency structure, the heat dissipation is enhanced by introducing cooling time between the TSD steps and by adopting an Al hard mask. A blade dicing method that prevents MEMS damage is also presented. The device operation is confirmed by measurements.",
keywords = "dicing, gravimeter, inertial sensor, MEMS, seismometer, silicon-on-glass",
author = "Jun Wu and Hui Zhang and Tamio Ikehashi",
note = "Publisher Copyright: {\textcopyright} 2023 IEEJ.; 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023 ; Conference date: 25-06-2023 Through 29-06-2023",
year = "2023",
language = "English",
series = "2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1492--1495",
booktitle = "2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023",
}