Fabrication of Ultra-Low Resonance Frequency Inertial MEMS using Through-Silicon Deep-RIE Applied to Silicon-on-Glass

Jun Wu, Hui Zhang, Tamio Ikehashi*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper reports on a fabrication process suitable for low-resonance-frequency inertial MEMS sensors. The low resonance frequency is attained by electrically tunable springs and a large mass formed by a through-silicon Deep-RIE (TSD) applied to a Silicon-on-Glass (SOG). To solve a thermal issue of TSD originating from the low-resonance-frequency structure, the heat dissipation is enhanced by introducing cooling time between the TSD steps and by adopting an Al hard mask. A blade dicing method that prevents MEMS damage is also presented. The device operation is confirmed by measurements.

Original languageEnglish
Title of host publication2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1492-1495
Number of pages4
ISBN (Electronic)9784886864352
Publication statusPublished - 2023
Event22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023 - Kyoto, Japan
Duration: 2023 Jun 252023 Jun 29

Publication series

Name2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023

Conference

Conference22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
Country/TerritoryJapan
CityKyoto
Period23/6/2523/6/29

Keywords

  • dicing
  • gravimeter
  • inertial sensor
  • MEMS
  • seismometer
  • silicon-on-glass

ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Control and Optimization
  • Instrumentation

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