Failure analysis of printed circuit boards in the main telephone system of marine product factory

Masamitsu Watanabe; Masaaki Takaya; Morihiko Matsumoto; Jun'ichi Sakai

doi:10.1016/j.engfailanal.2016.01.006

Failure analysis of printed circuit boards in the main telephone system of marine product factory

Masamitsu Watanabe^*, Masaaki Takaya, Morihiko Matsumoto, Jun'ichi Sakai

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

The failure of the main telephone system in a marine product factory due to copper sulfide (Cu₂S) creep was analyzed by the measurement of hydrogen sulfide (H₂S) in the atmosphere, elemental analysis with energy dispersive X-ray spectroscopy, and cross-sectional observation of vias in the printed circuit boards. Indoor H₂S concentrations were higher than outdoor ones and these corresponded to the G2 and/or G3 levels defined in ISA S71.04-1985. The chemical composition of the copper sulfide creep indicates that it consisted of copper, oxygen, and sulfur. Cross-sectional observation and elemental mapping analysis showed that Cu₂S creep initiated not at the edge of the organic coating (organic solder preservative, OSP) inside the vias but mainly at defects in the organic coating covering the copper.

Original language	English
Journal	Engineering Failure Analysis
DOIs	https://doi.org/10.1016/j.engfailanal.2016.01.006
Publication status	Accepted/In press - 2015 Jul 27

Keywords

Copper
Hydrogen sulfide
Printed circuit board
Sulfide creep
Via

ASJC Scopus subject areas

Materials Science(all)
Engineering(all)

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1016/j.engfailanal.2016.01.006

Cite this

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title = "Failure analysis of printed circuit boards in the main telephone system of marine product factory",

abstract = "The failure of the main telephone system in a marine product factory due to copper sulfide (Cu2S) creep was analyzed by the measurement of hydrogen sulfide (H2S) in the atmosphere, elemental analysis with energy dispersive X-ray spectroscopy, and cross-sectional observation of vias in the printed circuit boards. Indoor H2S concentrations were higher than outdoor ones and these corresponded to the G2 and/or G3 levels defined in ISA S71.04-1985. The chemical composition of the copper sulfide creep indicates that it consisted of copper, oxygen, and sulfur. Cross-sectional observation and elemental mapping analysis showed that Cu2S creep initiated not at the edge of the organic coating (organic solder preservative, OSP) inside the vias but mainly at defects in the organic coating covering the copper.",

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T1 - Failure analysis of printed circuit boards in the main telephone system of marine product factory

AU - Watanabe, Masamitsu

AU - Takaya, Masaaki

AU - Matsumoto, Morihiko

AU - Sakai, Jun'ichi

PY - 2015/7/27

Y1 - 2015/7/27

N2 - The failure of the main telephone system in a marine product factory due to copper sulfide (Cu2S) creep was analyzed by the measurement of hydrogen sulfide (H2S) in the atmosphere, elemental analysis with energy dispersive X-ray spectroscopy, and cross-sectional observation of vias in the printed circuit boards. Indoor H2S concentrations were higher than outdoor ones and these corresponded to the G2 and/or G3 levels defined in ISA S71.04-1985. The chemical composition of the copper sulfide creep indicates that it consisted of copper, oxygen, and sulfur. Cross-sectional observation and elemental mapping analysis showed that Cu2S creep initiated not at the edge of the organic coating (organic solder preservative, OSP) inside the vias but mainly at defects in the organic coating covering the copper.

AB - The failure of the main telephone system in a marine product factory due to copper sulfide (Cu2S) creep was analyzed by the measurement of hydrogen sulfide (H2S) in the atmosphere, elemental analysis with energy dispersive X-ray spectroscopy, and cross-sectional observation of vias in the printed circuit boards. Indoor H2S concentrations were higher than outdoor ones and these corresponded to the G2 and/or G3 levels defined in ISA S71.04-1985. The chemical composition of the copper sulfide creep indicates that it consisted of copper, oxygen, and sulfur. Cross-sectional observation and elemental mapping analysis showed that Cu2S creep initiated not at the edge of the organic coating (organic solder preservative, OSP) inside the vias but mainly at defects in the organic coating covering the copper.

KW - Copper

KW - Hydrogen sulfide

KW - Printed circuit board

KW - Sulfide creep

KW - Via

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Failure analysis of printed circuit boards in the main telephone system of marine product factory

Abstract

Keywords

ASJC Scopus subject areas

UN SDGs

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