TY - GEN
T1 - Feasibility Evaluation of Mixed Reality Obstacles on Treadmill using HoloLens to Elicit Real Obstacle Negotiation
AU - Miyake, Tamon
AU - Al-Sada, Mohammed
AU - Zhong, Tingting
AU - Wang, Wei
AU - Sugano, Shigeki
N1 - Funding Information:
This work was supported in part by the Program for Leading Graduate Schools, “Graduate Program for Embodiment Informatics” ofthe Ministry of Education, Culture, Sports, Science and Technology (MEXT) of Japan, Grants-in-Aid for JSPS, and the Research Institute for Science and Engineering, Waseda University. Tamon Miyake is with the Faculty of Science and Engineering, Waseda University, Tokyo, Japan (corresponding author, e-mail: tamon-tamonc3@ruri.waseda.jp). Mohammed Al-Sada is with the Faculty of Science and Engineering, Waseda University, Tokyo, Japan, and with the Department of Computer Science and Engineering, Qatar University, Doha, Qatar. Tingting Zhong is with Department of Automation, Tsinghua University, Shenzhen, China. Wei Wang is with the Graduate School of Creative Science and Engineering, Waseda University, Tokyo, Japan Shigeki Sugano is with the Faculty of Science and Engineering, Waseda University, Tokyo, Japan.
Publisher Copyright:
© 2021 IEEE.
PY - 2021/1/11
Y1 - 2021/1/11
N2 - An ability of visually-guided and anticipatory adjustments of locomotion corresponding to upcoming obstacles is important to avoid trip-induced fall. For establishing gait training based on visually-guided and anticipatory adjustments, techniques reproducing realistic training environment are essential. Although some previous works proposed virtual obstacles using mixed reality, the feasibility of virtual obstacles encouraging people to perform realistic obstacle negotiation on a treadmill, where gait training is usually conducted, is still unclear. In this study, we investigated toe heights when stepping over the obstacle in both cases of virtual and real obstacles during walking on the treadmill. Five participants stepped over two types of mixed reality boxes and real boxes, with box placements close and distant from them. The results generally indicate that the toe heights of the leading foot tended to be similar between mixed reality and real obstacles in cases where the obstacle was located distant from participants, a condition that enabled participants to predict when obstacles approached. However, the toe heights of the trailing foot tended to be lower when stepping over the MR obstacles than the real obstacles. We discuss the feasibility and shortcomings of the future use of MR HMDs as replacement for traditional gait training setup.
AB - An ability of visually-guided and anticipatory adjustments of locomotion corresponding to upcoming obstacles is important to avoid trip-induced fall. For establishing gait training based on visually-guided and anticipatory adjustments, techniques reproducing realistic training environment are essential. Although some previous works proposed virtual obstacles using mixed reality, the feasibility of virtual obstacles encouraging people to perform realistic obstacle negotiation on a treadmill, where gait training is usually conducted, is still unclear. In this study, we investigated toe heights when stepping over the obstacle in both cases of virtual and real obstacles during walking on the treadmill. Five participants stepped over two types of mixed reality boxes and real boxes, with box placements close and distant from them. The results generally indicate that the toe heights of the leading foot tended to be similar between mixed reality and real obstacles in cases where the obstacle was located distant from participants, a condition that enabled participants to predict when obstacles approached. However, the toe heights of the trailing foot tended to be lower when stepping over the MR obstacles than the real obstacles. We discuss the feasibility and shortcomings of the future use of MR HMDs as replacement for traditional gait training setup.
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U2 - 10.1109/IEEECONF49454.2021.9382780
DO - 10.1109/IEEECONF49454.2021.9382780
M3 - Conference contribution
AN - SCOPUS:85103740343
T3 - 2021 IEEE/SICE International Symposium on System Integration, SII 2021
SP - 756
EP - 761
BT - 2021 IEEE/SICE International Symposium on System Integration, SII 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 IEEE/SICE International Symposium on System Integration, SII 2021
Y2 - 11 January 2021 through 14 January 2021
ER -