TY - GEN
T1 - Fine-pitch hybrid bonding with Cu/Sn microbumps and adhesive for high density 3D integration
AU - Ohyama, Masaki
AU - Mizuno, Jun
AU - Shoji, Shuichi
AU - Nimura, Masatsugu
AU - Nonaka, Toshihisa
AU - Shinba, Yoichi
AU - Shigetou, Akitsu
PY - 2014/1/1
Y1 - 2014/1/1
N2 - In this study, we developed single-pitch hybrid bonding technology for high density 3D integration. To realize the single-pitch, smaller than 10-μm pitch, hybrid bonding, 8 μm-pitch Cu/Sn microbumps and nonconductive film (NCF) were used. The planar structure to simultaneously bond was formed by chemical mechanical polishing (CMP). After the planarization, the Cu/Sn bumps and NCF were simultaneously bonded at 250 °C for 60 s. Cross sectional observation of the bonded sample by scanning electron microscope (SEM) indicated that 8 μm-pitch bump bonding was carried out successfully and the NCF filled the 2.5-μm gap between the chip and substrate without significant voids. In addition, a tensile test was performed as a mechanical reliability test. The tensile strength was 3.86 MPa. From SEM observation of the fractured surface after the tensile test, the fractured surface of the bumps was intermetallic compound (IMC) layer between Cu and Sn. These results indicated that hybrid bonding was effective method for single-pitch bonding and underfilling.
AB - In this study, we developed single-pitch hybrid bonding technology for high density 3D integration. To realize the single-pitch, smaller than 10-μm pitch, hybrid bonding, 8 μm-pitch Cu/Sn microbumps and nonconductive film (NCF) were used. The planar structure to simultaneously bond was formed by chemical mechanical polishing (CMP). After the planarization, the Cu/Sn bumps and NCF were simultaneously bonded at 250 °C for 60 s. Cross sectional observation of the bonded sample by scanning electron microscope (SEM) indicated that 8 μm-pitch bump bonding was carried out successfully and the NCF filled the 2.5-μm gap between the chip and substrate without significant voids. In addition, a tensile test was performed as a mechanical reliability test. The tensile strength was 3.86 MPa. From SEM observation of the fractured surface after the tensile test, the fractured surface of the bumps was intermetallic compound (IMC) layer between Cu and Sn. These results indicated that hybrid bonding was effective method for single-pitch bonding and underfilling.
KW - fine pitch
KW - hybrid bonding
KW - microbump
KW - nonconductive film
KW - three-dimensional integration
KW - underfill
UR - http://www.scopus.com/inward/record.url?scp=84903733336&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84903733336&partnerID=8YFLogxK
U2 - 10.1109/ICEP.2014.6826751
DO - 10.1109/ICEP.2014.6826751
M3 - Conference contribution
AN - SCOPUS:84903733336
SN - 9784904090107
T3 - 2014 International Conference on Electronics Packaging, ICEP 2014
SP - 604
EP - 607
BT - 2014 International Conference on Electronics Packaging, ICEP 2014
PB - IEEE Computer Society
T2 - 2014 International Conference on Electronics Packaging, ICEP 2014
Y2 - 23 April 2014 through 25 April 2014
ER -