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Fine-pitch interconnection by hybrid Cu/Sn-adhesive bonding for 3D integration
Masaki Ohyama, Jun Mizuno, Shuichi Shoji, Masatsugu Nimura, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1
Citation
(Scopus)