Flip chip bonding of a quartz MEMS-based vibrating beam accelerometer

Jinxing Liang; Liyuan Zhang; Ling Wang; Yuan Dong; Toshitsugu Ueda

doi:10.3390/s150922049

Flip chip bonding of a quartz MEMS-based vibrating beam accelerometer

Jinxing Liang^*, Liyuan Zhang, Ling Wang, Yuan Dong, Toshitsugu Ueda

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

16 Citations (Scopus)

Abstract

In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 μm and 300 μm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 × 8 mm<sup>2</sup> chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved.

Original language	English
Pages (from-to)	22049-22059
Number of pages	11
Journal	Sensors (Switzerland)
Volume	15
Issue number	9
DOIs	https://doi.org/10.3390/s150922049
Publication status	Published - 2015 Sept 2

Keywords

Double ended tuning fork
Flip chip bonding
Quartz MEMS
Self-alignment
Vibrating beam accelerometer

ASJC Scopus subject areas

Electrical and Electronic Engineering
Atomic and Molecular Physics, and Optics
Analytical Chemistry
Biochemistry

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10.3390/s150922049

Cite this

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title = "Flip chip bonding of a quartz MEMS-based vibrating beam accelerometer",

abstract = "In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 μm and 300 μm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 × 8 mm2 chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved.",

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author = "Jinxing Liang and Liyuan Zhang and Ling Wang and Yuan Dong and Toshitsugu Ueda",

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TY - JOUR

T1 - Flip chip bonding of a quartz MEMS-based vibrating beam accelerometer

AU - Liang, Jinxing

AU - Zhang, Liyuan

AU - Wang, Ling

AU - Dong, Yuan

AU - Ueda, Toshitsugu

PY - 2015/9/2

Y1 - 2015/9/2

N2 - In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 μm and 300 μm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 × 8 mm2 chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved.

AB - In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 μm and 300 μm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 × 8 mm2 chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved.

KW - Double ended tuning fork

KW - Flip chip bonding

KW - Quartz MEMS

KW - Self-alignment

KW - Vibrating beam accelerometer

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Flip chip bonding of a quartz MEMS-based vibrating beam accelerometer

Abstract

Keywords

ASJC Scopus subject areas

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