Flip chip bonding of a quartz MEMS-based vibrating beam accelerometer

Jinxing Liang*, Liyuan Zhang, Ling Wang, Yuan Dong, Toshitsugu Ueda

*Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    16 Citations (Scopus)


    In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 μm and 300 μm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 × 8 mm<sup>2</sup> chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved.

    Original languageEnglish
    Pages (from-to)22049-22059
    Number of pages11
    JournalSensors (Switzerland)
    Issue number9
    Publication statusPublished - 2015 Sept 2


    • Double ended tuning fork
    • Flip chip bonding
    • Quartz MEMS
    • Self-alignment
    • Vibrating beam accelerometer

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Atomic and Molecular Physics, and Optics
    • Analytical Chemistry
    • Biochemistry


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