Flip-Chip Interconnection Lumped-Electrode EADFB Laser for 100-Gb/s/λ Transmitter

Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Toshio Ito, Yuta Ueda, Wataru Kobayashi, Hiroyuki Ishii, Hiroaki Sanjoh

Research output: Contribution to journalArticlepeer-review

41 Citations (Scopus)


We have achieved the 100-Gb/s/λ operation of a flip-chip interconnection 1.3-μm lumped-electrode electroabsorption modulator integrated with a distributed feedback laser module for the first time. The flip-chip interconnection provides a flatter frequency response characteristic and a higher modulation bandwidth. Clear eye opening was achieved for 103-Gb/s nonreturn to zero and equalizer-free 56-GBd 4-pulse-amplitude modulation operation after a 10-km single-mode fiber transmission.

Original languageEnglish
Article number7113803
Pages (from-to)1699-1701
Number of pages3
JournalIEEE Photonics Technology Letters
Issue number16
Publication statusPublished - 2015 Aug 15
Externally publishedYes


  • 100 Gb/s
  • Distributed feedback (DFB) laser
  • EADFB laser
  • Ethernet
  • InGaAlAs
  • electroabsorption modulator (EAM)
  • flip-chip interconnection

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering


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