TY - JOUR
T1 - Foldable Kirigami Paper Electronics
AU - Yang, Tilo H.
AU - Hida, Hikaru
AU - Ichige, Daiki
AU - Mizuno, Jun
AU - Robert Kao, C.
AU - Shintake, Jun
N1 - Funding Information:
All authors contributed equally to the work. The study was partially supported by the Leading Initiative for Excellent Young Researchers (LEADER) and the JSPS KAKENHI Grant‐in‐Aid for Scientific Research on Innovative Areas “Science of Soft Robot” project (grant no. 19H05328) and by the visiting Ph.D. student program sponsored by the Japan–Taiwan Exchange Association.
Funding Information:
All authors contributed equally to the work. The study was partially supported by the Leading Initiative for Excellent Young Researchers (LEADER) and the JSPS KAKENHI Grant-in-Aid for Scientific Research on Innovative Areas ?Science of Soft Robot? project (grant no. 19H05328) and by the visiting Ph.D. student program sponsored by the Japan?Taiwan Exchange Association.
Publisher Copyright:
© 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
PY - 2020/5/1
Y1 - 2020/5/1
N2 - Significant attention is focused on paper electronics (PEs) for developing flexible and recyclable devices. These devices use paper as the substrate on which electrode materials are successively patterned. Among various conductive materials used for PEs, nanosilver ink is the most commonly used material due to its low cost and easy printing process. However, nanosilver electrodes tend to fracture when a paper substrate is bent or folded, leading to disconnections in printed circuits. To maintain the integrity of the circuit pattern during folding, a novel Kirigami fabrication method for PEs is proposed, in which a paper substrate is prepared by cutting along the edge of the printed electrode prior to use. The Kirigami method is experimentally proven to turn the deformation mode of nanosilver electrodes from bending to twisting, which effectively prevents electrodes from fracture. Experimental measurements reveal that the electrical resistance of the Kirigami electrode increases by merely 30% under full folding. Conductivity is maintained after full folding for 100 cycles. Finally, the Kirigami strategy is applied to different foldable PEs including angle sensors, electrostatic actuators, and locomotion robots. The successful implementation of the Kirigami strategy demonstrates high potential for use in diverse PEs with complicated foldable 3D architectures.
AB - Significant attention is focused on paper electronics (PEs) for developing flexible and recyclable devices. These devices use paper as the substrate on which electrode materials are successively patterned. Among various conductive materials used for PEs, nanosilver ink is the most commonly used material due to its low cost and easy printing process. However, nanosilver electrodes tend to fracture when a paper substrate is bent or folded, leading to disconnections in printed circuits. To maintain the integrity of the circuit pattern during folding, a novel Kirigami fabrication method for PEs is proposed, in which a paper substrate is prepared by cutting along the edge of the printed electrode prior to use. The Kirigami method is experimentally proven to turn the deformation mode of nanosilver electrodes from bending to twisting, which effectively prevents electrodes from fracture. Experimental measurements reveal that the electrical resistance of the Kirigami electrode increases by merely 30% under full folding. Conductivity is maintained after full folding for 100 cycles. Finally, the Kirigami strategy is applied to different foldable PEs including angle sensors, electrostatic actuators, and locomotion robots. The successful implementation of the Kirigami strategy demonstrates high potential for use in diverse PEs with complicated foldable 3D architectures.
KW - electrostatic capacity-type sensors and actuators
KW - flexible electronics
KW - nanosilver ink
KW - paper electronics
KW - printed electronics
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U2 - 10.1002/pssa.201900891
DO - 10.1002/pssa.201900891
M3 - Article
AN - SCOPUS:85082817103
SN - 1862-6300
VL - 217
JO - Physica Status Solidi (A) Applications and Materials Science
JF - Physica Status Solidi (A) Applications and Materials Science
IS - 9
M1 - 1900891
ER -