Formation of Microprobe Using Nickel Electrodeposition

Yuko Sugai; Fujio Asa; Yasuyuki Okada; Tokihiko Yokoshima; Toshiyuki Momma; Tetsuya Osaka; Tadatsugu Ito

doi:10.5796/electrochemistry.67.1150

Formation of Microprobe Using Nickel Electrodeposition

Yuko Sugai^*, Fujio Asa, Yasuyuki Okada, Tokihiko Yokoshima, Toshiyuki Momma, Tetsuya Osaka, Tadatsugu Ito

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

Formation of Ni microstructure with high aspect ratio without thicker photoresist was tried by an electrcdeposition method. The Ni microprobes thicker than photoresist thickness were electrodeposited on a patterned substrate using thin photoresist patterned with UV radiation. It was important for preparing Ni microprobe with high aspect ratio to keep the overpotential of patterned cathode higher, and moreover the agitation using a paddle plating cell system was so effective to form uniform microprobes.

Original language	English
Pages (from-to)	1150-1152
Number of pages	3
Journal	Electrochemistry
Volume	67
Issue number	12
DOIs	https://doi.org/10.5796/electrochemistry.67.1150
Publication status	Published - 1999 Dec

Keywords

High Aspect Ratio
Micro-patterning
Ni Electrodeposition

ASJC Scopus subject areas

Electrochemistry

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10.5796/electrochemistry.67.1150

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title = "Formation of Microprobe Using Nickel Electrodeposition",

abstract = "Formation of Ni microstructure with high aspect ratio without thicker photoresist was tried by an electrcdeposition method. The Ni microprobes thicker than photoresist thickness were electrodeposited on a patterned substrate using thin photoresist patterned with UV radiation. It was important for preparing Ni microprobe with high aspect ratio to keep the overpotential of patterned cathode higher, and moreover the agitation using a paddle plating cell system was so effective to form uniform microprobes.",

keywords = "High Aspect Ratio, Micro-patterning, Ni Electrodeposition",

author = "Yuko Sugai and Fujio Asa and Yasuyuki Okada and Tokihiko Yokoshima and Toshiyuki Momma and Tetsuya Osaka and Tadatsugu Ito",

year = "1999",

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doi = "10.5796/electrochemistry.67.1150",

language = "English",

volume = "67",

pages = "1150--1152",

journal = "Electrochemistry",

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publisher = "Electrochemical Society of Japan",

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TY - JOUR

T1 - Formation of Microprobe Using Nickel Electrodeposition

AU - Sugai, Yuko

AU - Asa, Fujio

AU - Okada, Yasuyuki

AU - Yokoshima, Tokihiko

AU - Momma, Toshiyuki

AU - Osaka, Tetsuya

AU - Ito, Tadatsugu

PY - 1999/12

Y1 - 1999/12

N2 - Formation of Ni microstructure with high aspect ratio without thicker photoresist was tried by an electrcdeposition method. The Ni microprobes thicker than photoresist thickness were electrodeposited on a patterned substrate using thin photoresist patterned with UV radiation. It was important for preparing Ni microprobe with high aspect ratio to keep the overpotential of patterned cathode higher, and moreover the agitation using a paddle plating cell system was so effective to form uniform microprobes.

AB - Formation of Ni microstructure with high aspect ratio without thicker photoresist was tried by an electrcdeposition method. The Ni microprobes thicker than photoresist thickness were electrodeposited on a patterned substrate using thin photoresist patterned with UV radiation. It was important for preparing Ni microprobe with high aspect ratio to keep the overpotential of patterned cathode higher, and moreover the agitation using a paddle plating cell system was so effective to form uniform microprobes.

KW - High Aspect Ratio

KW - Micro-patterning

KW - Ni Electrodeposition

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SN - 1344-3542

VL - 67

SP - 1150

EP - 1152

JO - Electrochemistry

JF - Electrochemistry

IS - 12

ER -

Formation of Microprobe Using Nickel Electrodeposition

Abstract

Keywords

ASJC Scopus subject areas

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