TY - GEN
T1 - Frequency accelerated partial discharge resistance of epoxy/clay nanocomposite prepared by newly developed organic modification and solubilization methods
AU - Tanaka, Toshikatsu
AU - Yazawa, Tatsuya
AU - Ohki, Yoshimichi
AU - Ochi, Mitsukazu
AU - Harada, Miyuki
AU - Imai, Takahiro
PY - 2007/12/1
Y1 - 2007/12/1
N2 - Frequency accelerated partial discharge degradation of epoxy nanocomposite with 5 wt % additions of clay (layered silicate) was evaluated by a rod-to-plane electrode system, and investigated in comparison with that of epoxy without clay. Comparisons were made as to erosion depth using a laser surface profilometer. It was found that the change in the erosion depth is far smaller in specimens with clay than those without clay. It was also found that the solubilization method using acid anhydride curing agent seems to give PD resistance characteristics superior to the organic modification method using amine and acid anhydride curing agents and even to the solubilization method using amine curing agent.
AB - Frequency accelerated partial discharge degradation of epoxy nanocomposite with 5 wt % additions of clay (layered silicate) was evaluated by a rod-to-plane electrode system, and investigated in comparison with that of epoxy without clay. Comparisons were made as to erosion depth using a laser surface profilometer. It was found that the change in the erosion depth is far smaller in specimens with clay than those without clay. It was also found that the solubilization method using acid anhydride curing agent seems to give PD resistance characteristics superior to the organic modification method using amine and acid anhydride curing agents and even to the solubilization method using amine curing agent.
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U2 - 10.1109/ICSD.2007.4290821
DO - 10.1109/ICSD.2007.4290821
M3 - Conference contribution
AN - SCOPUS:47349109804
SN - 1424407516
SN - 9781424407514
T3 - 2007 International Conference on Solid Dielectrics, ICSD
SP - 337
EP - 340
BT - 2007 International Conference on Solid Dielectrics, ICSD
T2 - 2007 International Conference on Solid Dielectrics, ICSD
Y2 - 8 July 2007 through 13 July 2007
ER -