TY - GEN
T1 - Full-scale whole device EMC/MD simulation of Si nanowire transistor including source and drain regions by utilizing graphic processing units
AU - Suzuki, Akito
AU - Watanabe, Takanobu
AU - Kamakura, Yoshinari
AU - Kamioka, Takefumi
PY - 2014/10/20
Y1 - 2014/10/20
N2 - We have realized the full-scale whole device EMC/MD simulation including source and drain regions by utilizing graphic processing unit. The transfer characteristic of a gate-all-around nanowire Si MOSFET is simulated by reproducing the field effect of the surrounding gate electrode with spreading charged particles on the gate insulator layer. We have found an appreciable impact of the random dopant distribution (RDF) in source and drain regions on the drain current variability. Furthermore, the dynamic fluctuation of the drain current is found to be increase as the channel length decreases. The EMC/MD simulation powered by GPU is a useful method to investigate the dynamic fluctuation as well as the statistical device-to-device variability of nano-scale FETs.
AB - We have realized the full-scale whole device EMC/MD simulation including source and drain regions by utilizing graphic processing unit. The transfer characteristic of a gate-all-around nanowire Si MOSFET is simulated by reproducing the field effect of the surrounding gate electrode with spreading charged particles on the gate insulator layer. We have found an appreciable impact of the random dopant distribution (RDF) in source and drain regions on the drain current variability. Furthermore, the dynamic fluctuation of the drain current is found to be increase as the channel length decreases. The EMC/MD simulation powered by GPU is a useful method to investigate the dynamic fluctuation as well as the statistical device-to-device variability of nano-scale FETs.
KW - Graphic Processing Unit (GPU)
KW - Si nanowire Transistor
KW - ensemble Monte Carlo/molecular dynamics (EMC/MD)
KW - random dopant fluctuation (RDF)
KW - random telegraph noise (RTN)
UR - http://www.scopus.com/inward/record.url?scp=84908671257&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84908671257&partnerID=8YFLogxK
U2 - 10.1109/SISPAD.2014.6931637
DO - 10.1109/SISPAD.2014.6931637
M3 - Conference contribution
AN - SCOPUS:84908671257
T3 - International Conference on Simulation of Semiconductor Processes and Devices, SISPAD
SP - 357
EP - 360
BT - International Conference on Simulation of Semiconductor Processes and Devices, SISPAD
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2014
Y2 - 9 September 2014 through 11 September 2014
ER -