Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding

R. Yamamoto; K. Sueyoshi; K. Otsuka; T. Kasahara; A. Nakahara; D. H. Yoon; J. Mizuno; T. Sekiguchi; S. Shoji

doi:10.1109/NEMS.2013.6559762

Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding

R. Yamamoto^*, K. Sueyoshi, K. Otsuka, T. Kasahara, A. Nakahara, D. H. Yoon, J. Mizuno, T. Sekiguchi, S. Shoji

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Au deposited SU-8 microdots comprised SU-8-PET microchip using low temperature polymer bonding technology is developed. A fine microdot array (1μm×1μm×0.5μm dots with 2μm pitch in area of 50μm×5mm) is fabricated by electron beam lithography (EBL) using SU-8 as a negative tone resist. A microchannel structure is formed with UV patterned SU-8 on a glass substrate. The SU-8 structure is sealed with a PET film by low temperature silane coupling bonding (140°C, 1.5MPa, 5min). The proposed microchip is fabricated successfully without leakage and is applicable as a microchip electrophoresis.

Original language	English
Title of host publication	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
Pages	418-421
Number of pages	4
DOIs	https://doi.org/10.1109/NEMS.2013.6559762
Publication status	Published - 2013 Sept 2
Event	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 - Suzhou, China Duration: 2013 Apr 7 → 2013 Apr 10

Publication series

Name	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013

Other

Other	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
Country/Territory	China
City	Suzhou
Period	13/4/7 → 13/4/10

Keywords

Au microdot array
SU-8 electron beam lithography
dielectrophoresis
low temperature silane coupling bonding
microchip electrophoresis

ASJC Scopus subject areas

Biochemistry, Genetics and Molecular Biology (miscellaneous)
Biotechnology

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10.1109/NEMS.2013.6559762

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Yamamoto, R., Sueyoshi, K., Otsuka, K., Kasahara, T., Nakahara, A., Yoon, D. H., Mizuno, J., Sekiguchi, T., & Shoji, S. (2013). Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding. In 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 (pp. 418-421). Article 6559762 (8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013). https://doi.org/10.1109/NEMS.2013.6559762

Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding. / Yamamoto, R.; Sueyoshi, K.; Otsuka, K. et al.
8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013. 2013. p. 418-421 6559762 (8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yamamoto, R, Sueyoshi, K, Otsuka, K, Kasahara, T, Nakahara, A, Yoon, DH, Mizuno, J, Sekiguchi, T & Shoji, S 2013, Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding. in 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013., 6559762, 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013, pp. 418-421, 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013, Suzhou, China, 13/4/7. https://doi.org/10.1109/NEMS.2013.6559762

Yamamoto R, Sueyoshi K, Otsuka K, Kasahara T, Nakahara A, Yoon DH et al. Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding. In 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013. 2013. p. 418-421. 6559762. (8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013). doi: 10.1109/NEMS.2013.6559762

Yamamoto, R. ; Sueyoshi, K. ; Otsuka, K. et al. / Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding. 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013. 2013. pp. 418-421 (8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013).

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abstract = "Au deposited SU-8 microdots comprised SU-8-PET microchip using low temperature polymer bonding technology is developed. A fine microdot array (1μm×1μm×0.5μm dots with 2μm pitch in area of 50μm×5mm) is fabricated by electron beam lithography (EBL) using SU-8 as a negative tone resist. A microchannel structure is formed with UV patterned SU-8 on a glass substrate. The SU-8 structure is sealed with a PET film by low temperature silane coupling bonding (140°C, 1.5MPa, 5min). The proposed microchip is fabricated successfully without leakage and is applicable as a microchip electrophoresis.",

keywords = "Au microdot array, SU-8 electron beam lithography, dielectrophoresis, low temperature silane coupling bonding, microchip electrophoresis",

author = "R. Yamamoto and K. Sueyoshi and K. Otsuka and T. Kasahara and A. Nakahara and Yoon, {D. H.} and J. Mizuno and T. Sekiguchi and S. Shoji",

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AU - Yamamoto, R.

AU - Sueyoshi, K.

AU - Otsuka, K.

AU - Kasahara, T.

AU - Nakahara, A.

AU - Yoon, D. H.

AU - Mizuno, J.

AU - Sekiguchi, T.

AU - Shoji, S.

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N2 - Au deposited SU-8 microdots comprised SU-8-PET microchip using low temperature polymer bonding technology is developed. A fine microdot array (1μm×1μm×0.5μm dots with 2μm pitch in area of 50μm×5mm) is fabricated by electron beam lithography (EBL) using SU-8 as a negative tone resist. A microchannel structure is formed with UV patterned SU-8 on a glass substrate. The SU-8 structure is sealed with a PET film by low temperature silane coupling bonding (140°C, 1.5MPa, 5min). The proposed microchip is fabricated successfully without leakage and is applicable as a microchip electrophoresis.

AB - Au deposited SU-8 microdots comprised SU-8-PET microchip using low temperature polymer bonding technology is developed. A fine microdot array (1μm×1μm×0.5μm dots with 2μm pitch in area of 50μm×5mm) is fabricated by electron beam lithography (EBL) using SU-8 as a negative tone resist. A microchannel structure is formed with UV patterned SU-8 on a glass substrate. The SU-8 structure is sealed with a PET film by low temperature silane coupling bonding (140°C, 1.5MPa, 5min). The proposed microchip is fabricated successfully without leakage and is applicable as a microchip electrophoresis.

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Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding

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