Grouping separated frequency components by estimating propagation model parameters in frequency-domain blind source separation

Hiroshi Sawada*, Shoko Araki, Ryo Mukai, Shoji Makino

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

104 Citations (Scopus)

Abstract

This paper proposes a new formulation and optimization procedure for grouping frequency components in frequency-domain blind source separation (BSS). We adopt two separation techniques, independent component analysis (ICA) and time-frequency (T-F) masking, for the frequency-domain BSS. With ICA, grouping the frequency components corresponds to aligning the permutation ambiguity of the ICA solution in each frequency bin. With T-F masking, grouping the frequency components corresponds to classifying sensor observations in the time-frequency domain for individual sources. The grouping procedure is based on estimating anechoic propagation model parameters by analyzing ICA results or sensor observations. More specifically, the time delays of arrival and attenuations from a source to all sensors are estimated for each source. The focus of this paper includes the applicability of the proposed procedure for a situation with wide sensor spacing where spatial aliasing may occur. Experimental results show that the proposed procedure effectively separates two or three sources with several sensor configurations in a real room, as long as the room reverberation is moderately low.

Original languageEnglish
Article number4244536
Pages (from-to)1592-1604
Number of pages13
JournalIEEE Transactions on Audio, Speech and Language Processing
Volume15
Issue number5
DOIs
Publication statusPublished - 2007 Jul
Externally publishedYes

Keywords

  • Blind source separation (BSS)
  • Convolutive mixture
  • Frequency domain
  • Generalized cross correlation
  • Independent component analysis (ICA)
  • Permutation problem
  • Sparseness
  • Time delay estimation
  • Time-frequency (T-F) masking

ASJC Scopus subject areas

  • Acoustics and Ultrasonics
  • Electrical and Electronic Engineering

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