@article{b0c40ff0a2b94c46a6ae568e9b6d7b35,
title = "HDTV1080p H.264/AVC encoder chip design and performance analysis",
abstract = "A H.264/AVC baseline-profile real-time encoder for HDTV-1080p at 30 fps is proposed in this paper. On the basis of the specifications and algorithm optimizations, the dedicated hardware engines and one 32-bit Media embedded Processor (MeP) equipped with hardware extensions are mapped into the three-stage macroblock pipelining system architecture. This paper describes the design considerations for chief components, including high throughput integer motion estimation, data reusing fractional motion estimation, and hardware friendly mode reduction for intra prediction. The 11.5 Gbps 64 Mb System-in-Silicon DRAM is embedded to alleviate the external memory bandwidth. Using TSMC one-poly six-metal 0.18 $\mu\hbox{m}$ CMOS technology, the prototype chip is implemented with 1140 k logic gates and 108.3 KB internal SRAM. The SoC core occupies 27.1 $\hbox{mm}^{2}$ die area and consumes 1.41 W at 200 MHz execution speed in typical work conditions.",
keywords = "H264/AVC, Hardwired encoder, Very large-scale integration (VLSI) architecture, Video coding, Video signal processing",
author = "Zhenyu Liu and Yang Song and Ming Shao and Shen Li and Lingfeng Li and Shunichi Ishiwata and Masaki Nakagawa and Satoshi Goto and Takeshi Ikenaga",
note = "Funding Information: Manuscript received February 06, 2008; revised August 26, 2008. Current version published January 27, 2009. This work was supported by the fund from CREST JST. Z. Liu, S. Goto, and T. Ikenaga are with the Graduate School of Information, Production and Systems, Waseda University, Kitakyushu 808-0135, Japan (e-mail: liuzhenyu@aoni.waseda.jp; goto@waseda.jp; ikenaga@waseda.jp). Y. Song is with Fujitsu Laboratories Ltd., Kawasaki 211-8588, Japan (e-mail: song.yang@jp.fujitsu.com). M. Shao is with NEC Electronics Corp., Kawasaki, Kanagawa 211-8668, Japan (e-mail: shao.ming@necel.com). L. Li is with Nemochips Inc., Shanghai 200135, China (e-mail: lingfeng. li@nemochips.com). S. Li, S. Ishiwata, and M. Nakagawa are with Digital Media SoC Department, Center for SoC Research and Development, Semiconductor Company, Toshiba Corp., Kawasaki 212-8520, Japan (e-mail: li.shen@toshiba.co.jp; shunichi.ishi-wata@toshiba.co.jp; masaki.nakagawa@toshiba.co.jp). Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/JSSC.2008.2010797",
year = "2009",
month = feb,
doi = "10.1109/JSSC.2008.2010797",
language = "English",
volume = "44",
pages = "594--608",
journal = "IEEE Journal of Solid-State Circuits",
issn = "0018-9200",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "2",
}