TY - GEN
T1 - Heatsink design using spiral-fins considering additive manufacturing
AU - Otake, Shingo
AU - Tateishi, Yoshihiro
AU - Gohara, Hiromichi
AU - Kato, Ryoichi
AU - Ikeda, Yoshinari
AU - Parque, Victor
AU - Faiz, Muhammed Khairi
AU - Yoshida, Makoto
AU - Miyashita, Tomoyuki
N1 - Publisher Copyright:
© 2019 Japan Institute of Electronics Packaging.
PY - 2019/4
Y1 - 2019/4
N2 - In recent years, there have been increasing the number of power modules which is required with high performance, miniaturization and weight saving. But these requires cause high heat generation density for power module, which gets junction operation temperature to rise. Cooling unit is thus greatly demanded for high heat dissipation. The simple shaped heatsinks (straight-fin type and pin fin type) were generally used. But they have the limit of cooling performance. In this report, we have developed new heatsink shape to cope with rapidly increasing of the cooling requirement. Cooling performance is shown to thermal resistance and pressure loss. We evaluated them by thermal fluid analysis. In this approach, the spiral-fin heatsink with spiral curved channels has excellent cooling performance. This shape is the unique point in this report. This is because the shape with three-dimensional regular curve has not been studied. The spiral-fin heatsink has many factors (fin thickness, fin pitch, the number of channels, etc.). These factors affect cooler performance. We changed these factors to determine the best shape of spiral-fin. As a result, the best shape is 14.9[%] lower than the straight-fin type in thermal resistance.
AB - In recent years, there have been increasing the number of power modules which is required with high performance, miniaturization and weight saving. But these requires cause high heat generation density for power module, which gets junction operation temperature to rise. Cooling unit is thus greatly demanded for high heat dissipation. The simple shaped heatsinks (straight-fin type and pin fin type) were generally used. But they have the limit of cooling performance. In this report, we have developed new heatsink shape to cope with rapidly increasing of the cooling requirement. Cooling performance is shown to thermal resistance and pressure loss. We evaluated them by thermal fluid analysis. In this approach, the spiral-fin heatsink with spiral curved channels has excellent cooling performance. This shape is the unique point in this report. This is because the shape with three-dimensional regular curve has not been studied. The spiral-fin heatsink has many factors (fin thickness, fin pitch, the number of channels, etc.). These factors affect cooler performance. We changed these factors to determine the best shape of spiral-fin. As a result, the best shape is 14.9[%] lower than the straight-fin type in thermal resistance.
KW - additive manufacturing
KW - cooling
KW - heatsink
KW - spiral-fin
KW - thermal resistance
UR - http://www.scopus.com/inward/record.url?scp=85068313298&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85068313298&partnerID=8YFLogxK
U2 - 10.23919/ICEP.2019.8733558
DO - 10.23919/ICEP.2019.8733558
M3 - Conference contribution
AN - SCOPUS:85068313298
T3 - 2019 International Conference on Electronics Packaging, ICEP 2019
SP - 46
EP - 51
BT - 2019 International Conference on Electronics Packaging, ICEP 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 International Conference on Electronics Packaging, ICEP 2019
Y2 - 17 April 2019 through 20 April 2019
ER -