TY - GEN
T1 - High aspect ratio nano-scale CFX structures fabricated by deep-RIE
AU - Arakawa, Takahiro
AU - Kusakawa, Hiroyuki
AU - Shoji, Shuichi
PY - 2007/12/1
Y1 - 2007/12/1
N2 - High aspect ratio (>500) nano-scale CFx (fluorocarbon) "tube" and "test-tube" arrays were realized using Deep Reactive Ion Etching (RIE). Sidewall CFx nano structures of 200 nm in thickness formed during Deep RIE passivation process were used for the purpose. The film thickness of CFx was controlled from 200 nm to 500 nm, and the height more than 100 μm was available. As a result, the aspect ratio is larger than 500. This fluorocarbon tube and test-tube array are useful tools for chemical and biological applications.
AB - High aspect ratio (>500) nano-scale CFx (fluorocarbon) "tube" and "test-tube" arrays were realized using Deep Reactive Ion Etching (RIE). Sidewall CFx nano structures of 200 nm in thickness formed during Deep RIE passivation process were used for the purpose. The film thickness of CFx was controlled from 200 nm to 500 nm, and the height more than 100 μm was available. As a result, the aspect ratio is larger than 500. This fluorocarbon tube and test-tube array are useful tools for chemical and biological applications.
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M3 - Conference contribution
AN - SCOPUS:52249086899
SN - 1424409519
SN - 9781424409518
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 287
EP - 290
BT - Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
T2 - 20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
Y2 - 21 January 2007 through 25 January 2007
ER -