High perpendicular coercivity electroless cobalt alloy films with 25 nm thicknesses

T. Ouchi*, Y. Arikawa, T. Kuno, T. Homma

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper describes the development of Co alloy films thinner than 50 nm with high perpendicular magnetic coercivity using an electroless deposition process. In order to obtain these films, we used a Cu underlayer for a heteroepitaxial growth of the Co alloys and an optimized bath composition which included sodium hypophosphite and hydrazine as reductants. As a results, the perpendicular coercivity of the films turned to be higher 3000 Oe at the initial deposition stage with the thickness lower than 80 nm. In particular, the high perpendicular magnetic coercivity of the film as thin as 25 nm thick was obtained. These results indicate that electroless deposition is applicable for formation of the films with high perpendicular magnetic coercivity by optimizing the deposition conditions.

Original languageEnglish
Title of host publicationElectrodeposition of Nanoengineered Materials and Devices 3
PublisherElectrochemical Society Inc.
Number of pages10
ISBN (Electronic)9781566778152
ISBN (Print)9781566778152
Publication statusPublished - 2009

Publication series

NameECS Transactions
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

ASJC Scopus subject areas

  • Engineering(all)


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