High power operation of Pnp AlGaN/GaN heterojunction bipolar transistors

K. Kumakura*, Y. Yamauchi, T. Makimoto

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)


We fabricated a Pnp AlGaN/GaN heterojunction bipolar transistor and investigated its common - emitter current - voltage characteristics at room temperature. The device structures were grown by metalorganic vapor phase epitaxy on the sapphire substrates. The buffer layer was a newly developed Al2O3/AlN/AlON/ Al2O3, resulting in the dislocation density of 6 × 108 cm-2 in MOVPE-grown GaN layer. This relatively low dislocation density led to the high voltage operation in the devices, corresponding to the breakdown field of 2.4 MV/cm. AlGaN/(Al)GaN superlattices were applied to the emitter and subcollector to increase the hole concentrations in these layers. An n-type GaN base width was 80 nm. The sheet resistivity and the specific contact resistance were 900 Ω/square and 2.6 × 10-5 Ω-cm2 for a 80 nm base, respectively. The base sheet resistivity of Pnp AlGaN/GaN HBT was two orders of magnitude smaller than that of Npn AlGaN/GaN HBTs. The maximum current gain was 8 at the collector current of 11.5 mA for the 30 μm × 50 μm device. It operated at the collector current of 20 mA at the collector - emitter voltage of 65 V with a current gain of 5. The corresponding current density and power density were 1.3 kA/cm2 and 84.5 kW/cm2. High power operation was achieved by using the relatively low dislocation density GaN and low resistance superlattices.

Original languageEnglish
Pages (from-to)2589-2592
Number of pages4
JournalPhysica Status Solidi C: Conferences
Issue number7
Publication statusPublished - 2005
Externally publishedYes

ASJC Scopus subject areas

  • Condensed Matter Physics


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