High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

Toshikatsu Tanaka; Zengbin Wang; Tomonori Iizuka; Masahiro Kozako; Yoshimichi Ohki

doi:10.1109/CEIDP.2011.6232750

High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

Toshikatsu Tanaka^*, Zengbin Wang, Tomonori Iizuka, Masahiro Kozako, Yoshimichi Ohki

^*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

4 Citations (Scopus)

Abstract

Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kV _peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.

Original language	English
Article number	6232750
Pages (from-to)	691-694
Number of pages	4
Journal	Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
DOIs	https://doi.org/10.1109/CEIDP.2011.6232750
Publication status	Published - 2011 Dec 1
Event	2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011 - Cancun, Mexico Duration: 2011 Oct 16 → 2011 Oct 19

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/CEIDP.2011.6232750

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@article{6ac65fc3ac324a79bd213321dcde1226,

title = "High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength",

abstract = "Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.",

author = "Toshikatsu Tanaka and Zengbin Wang and Tomonori Iizuka and Masahiro Kozako and Yoshimichi Ohki",

year = "2011",

month = dec,

day = "1",

doi = "10.1109/CEIDP.2011.6232750",

language = "English",

pages = "691--694",

journal = "Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP",

issn = "0084-9162",

note = "2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011 ; Conference date: 16-10-2011 Through 19-10-2011",

}

TY - JOUR

T1 - High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

AU - Tanaka, Toshikatsu

AU - Wang, Zengbin

AU - Iizuka, Tomonori

AU - Kozako, Masahiro

AU - Ohki, Yoshimichi

PY - 2011/12/1

Y1 - 2011/12/1

N2 - Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.

AB - Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.

UR - http://www.scopus.com/inward/record.url?scp=84864694945&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84864694945&partnerID=8YFLogxK

U2 - 10.1109/CEIDP.2011.6232750

DO - 10.1109/CEIDP.2011.6232750

M3 - Conference article

AN - SCOPUS:84864694945

SN - 0084-9162

SP - 691

EP - 694

JO - Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

JF - Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

M1 - 6232750

T2 - 2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011

Y2 - 16 October 2011 through 19 October 2011

ER -

High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

Abstract

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