Hybrid Au-underfill resin bonding with lock-and-key structure

Masatsugu Nimura*, Akitsu Shigetou, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Jun Mizuno, Shuichi Shoji

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)


We developed a novel hybrid bonding technology for Au ultralow-profiled bumps and underfill resin with a modified "lock-and-key structure." The lock structure interlocks with the key structure. We applied these structures to perform an entire adhesion between the mating surfaces in place of conventional underfilling technique. To fabricate the key structure, we developed a simple process that can remove resin on the bumps. Lock structure was fabricated by photolithography and dry etching. After the bonding was carried out, the bonded interface was observed with a Scanning Electron Microscope (SEM), a transmission electron microscope (TEM) and a Scanning Acoustic Microscope (SAM). The results proved that no significant gap was existed at both Au-Au and resin-resin interface. Furthermore, the shear strength of the bonded sample with resin was ten times stronger than that without resin. The conduction of Au bump connections after hybrid bonding was also confirmed.

Original languageEnglish
Title of host publication2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Number of pages5
Publication statusPublished - 2012 Oct 4
Event2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA, United States
Duration: 2012 May 292012 Jun 1

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503


Conference2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
Country/TerritoryUnited States
CitySan Diego, CA

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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