TY - GEN
T1 - Hybrid film for self-adhesion and shape-controlling
AU - Shimbo, Sota
AU - Fujie, Toshinori
AU - Iwase, Eiji
N1 - Publisher Copyright:
© 2017 IEEE.
Copyright:
Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2017/2/23
Y1 - 2017/2/23
N2 - We report a hybrid film that is composed of 'polymer nanosheet' with a hundreds-of-nanometer-thick film and 'punched film' with hundreds-of-micrometer-thick film. Because of the thickness, the nanosheet is able to adhere to biological tissues without a glue, but is sometimes difficult to handling. Our hybrid film is established both adhesiveness of the nanosheet and shape-controlling ability of the punched film. In this paper, first, we fabricated the cylindrical-shaped hybrid film. Next, we achieved the hybrid film unfold into flat shape. Finally, we evaluated the adhesion force of the hybrid film and confirmed that the hybrid film can adhere to biological tissues.
AB - We report a hybrid film that is composed of 'polymer nanosheet' with a hundreds-of-nanometer-thick film and 'punched film' with hundreds-of-micrometer-thick film. Because of the thickness, the nanosheet is able to adhere to biological tissues without a glue, but is sometimes difficult to handling. Our hybrid film is established both adhesiveness of the nanosheet and shape-controlling ability of the punched film. In this paper, first, we fabricated the cylindrical-shaped hybrid film. Next, we achieved the hybrid film unfold into flat shape. Finally, we evaluated the adhesion force of the hybrid film and confirmed that the hybrid film can adhere to biological tissues.
UR - http://www.scopus.com/inward/record.url?scp=85015750921&partnerID=8YFLogxK
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U2 - 10.1109/MEMSYS.2017.7863485
DO - 10.1109/MEMSYS.2017.7863485
M3 - Conference contribution
AN - SCOPUS:85015750921
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 624
EP - 627
BT - 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
Y2 - 22 January 2017 through 26 January 2017
ER -