Impact of 0.10 μm SOI CMOS with body-tied hybrid trench isolation structure to break through the scaling crisis of silicon technology

Y. Hirano*, T. Matsumoto, S. Maeda, T. Iwamatsu, T. Kunikiyo, K. Nii, K. Yamamoto, Y. Yamaguchi, T. Ipposhi, S. Maegawa, M. Inuishi

*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

28 Citations (Scopus)

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