Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica

Mayumi Hyuga; Naoki Tagami; Toshikatsu Tanaka; Yoshimichi Ohki; Takahiro Imai; Miyuki Harada; Mitsukazu Ochi

doi:10.1109/CEIDP.2009.5377845

Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica

Mayumi Hyuga^*, Naoki Tagami, Toshikatsu Tanaka, Yoshimichi Ohki, Takahiro Imai, Miyuki Harada, Mitsukazu Ochi

^*Corresponding author for this work

School of Advanced Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Effects of addition of micro-sized silica fillers and/or nano-sized clay fillers into epoxy resin on its dielectric properties were examined. The glass transition intermediate temperature (T_g) was found to show a decrease by the addition of a small amount of nanofillers, while it is increased by the addition of abundant microfillers with and without co-addition of a small amount of nanofillers. At temperatures above T_g, the samples with abundant microfillers were added have low conductivity, low dielectric constant, and low dielectric loss factor regardless of the co-addition of nanofillers.

Original language	English
Title of host publication	CEIDP - 2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena
Pages	519-522
Number of pages	4
DOIs	https://doi.org/10.1109/CEIDP.2009.5377845
Publication status	Published - 2009 Dec 1
Event	2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP - Virginia Beach, VA, United States Duration: 2009 Oct 18 → 2009 Oct 21

Publication series

Name	Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
ISSN (Print)	0084-9162

Conference

Conference	2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
Country/Territory	United States
City	Virginia Beach, VA
Period	09/10/18 → 09/10/21

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/CEIDP.2009.5377845

Cite this

Hyuga, M., Tagami, N., Tanaka, T., Ohki, Y., Imai, T., Harada, M., & Ochi, M. (2009). Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica. In CEIDP - 2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena (pp. 519-522). [5377845] (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP). https://doi.org/10.1109/CEIDP.2009.5377845

Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica. / Hyuga, Mayumi; Tagami, Naoki; Tanaka, Toshikatsu et al.
CEIDP - 2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena. 2009. p. 519-522 5377845 (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hyuga, M, Tagami, N, Tanaka, T, Ohki, Y, Imai, T, Harada, M & Ochi, M 2009, Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica. in CEIDP - 2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena., 5377845, Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, pp. 519-522, 2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, Virginia Beach, VA, United States, 09/10/18. https://doi.org/10.1109/CEIDP.2009.5377845

Hyuga M, Tagami N, Tanaka T, Ohki Y, Imai T, Harada M et al. Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica. In CEIDP - 2009 Annual Report Conference on Electrical Insulation and Dielectric Phenomena. 2009. p. 519-522. 5377845. (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP). doi: 10.1109/CEIDP.2009.5377845

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abstract = "Effects of addition of micro-sized silica fillers and/or nano-sized clay fillers into epoxy resin on its dielectric properties were examined. The glass transition intermediate temperature (Tg) was found to show a decrease by the addition of a small amount of nanofillers, while it is increased by the addition of abundant microfillers with and without co-addition of a small amount of nanofillers. At temperatures above Tg, the samples with abundant microfillers were added have low conductivity, low dielectric constant, and low dielectric loss factor regardless of the co-addition of nanofillers.",

author = "Mayumi Hyuga and Naoki Tagami and Toshikatsu Tanaka and Yoshimichi Ohki and Takahiro Imai and Miyuki Harada and Mitsukazu Ochi",

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AU - Hyuga, Mayumi

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AU - Imai, Takahiro

AU - Harada, Miyuki

AU - Ochi, Mitsukazu

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AB - Effects of addition of micro-sized silica fillers and/or nano-sized clay fillers into epoxy resin on its dielectric properties were examined. The glass transition intermediate temperature (Tg) was found to show a decrease by the addition of a small amount of nanofillers, while it is increased by the addition of abundant microfillers with and without co-addition of a small amount of nanofillers. At temperatures above Tg, the samples with abundant microfillers were added have low conductivity, low dielectric constant, and low dielectric loss factor regardless of the co-addition of nanofillers.

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Improvement in high-temperature dielectric properties of epoxy resin by abundant addition of micro-silica

Abstract

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ASJC Scopus subject areas

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