Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character

S. Terashima; T. Kohno; A. Mizusawa; K. Arai; O. Okada; T. Wakabayashi; M. Tanaka; K. Tatsumi

doi:10.1007/s11664-008-0560-y

Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character

S. Terashima^*, T. Kohno, A. Mizusawa, K. Arai, O. Okada, T. Wakabayashi, M. Tanaka, K. Tatsumi

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

32 Citations (Scopus)

Abstract

Thermal fatigue properties of commercial LF35 (Sn-1.2Ag-0.5Cu-0.05Ni), SAC105 (Sn-1Ag-0.5Cu), and SAC305 (Sn-3Ag-0.5Cu) solders on Casio's wafer-level packages are discussed from the viewpoints of both morphology and grain boundary character. Orientation imaging microscopy revealed that both LF35 and SAC305 resisted the coarsening of tin grains during thermal fatigue as compared with SAC105, correlating with their greater fraction of coincidence site lattice boundaries. This seems to explain why LF35 has superior thermal fatigue life in spite of its lower silver content.

Original language	English
Pages (from-to)	33-38
Number of pages	6
Journal	Journal of Electronic Materials
Volume	38
Issue number	1
DOIs	https://doi.org/10.1007/s11664-008-0560-y
Publication status	Published - 2009 Jan
Externally published	Yes

Keywords

Grain boundary character distribution
Lead-free solder
Orientation imaging microscopy
Sn-Ag-Cu
Thermal fatigue

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-008-0560-y

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Terashima, S, Kohno, T, Mizusawa, A, Arai, K, Okada, O, Wakabayashi, T, Tanaka, M & Tatsumi, K 2009, 'Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character', Journal of Electronic Materials, vol. 38, no. 1, pp. 33-38. https://doi.org/10.1007/s11664-008-0560-y

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title = "Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character",

abstract = "Thermal fatigue properties of commercial LF35 (Sn-1.2Ag-0.5Cu-0.05Ni), SAC105 (Sn-1Ag-0.5Cu), and SAC305 (Sn-3Ag-0.5Cu) solders on Casio's wafer-level packages are discussed from the viewpoints of both morphology and grain boundary character. Orientation imaging microscopy revealed that both LF35 and SAC305 resisted the coarsening of tin grains during thermal fatigue as compared with SAC105, correlating with their greater fraction of coincidence site lattice boundaries. This seems to explain why LF35 has superior thermal fatigue life in spite of its lower silver content.",

keywords = "Grain boundary character distribution, Lead-free solder, Orientation imaging microscopy, Sn-Ag-Cu, Thermal fatigue",

author = "S. Terashima and T. Kohno and A. Mizusawa and K. Arai and O. Okada and T. Wakabayashi and M. Tanaka and K. Tatsumi",

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T1 - Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character

AU - Terashima, S.

AU - Kohno, T.

AU - Mizusawa, A.

AU - Arai, K.

AU - Okada, O.

AU - Wakabayashi, T.

AU - Tanaka, M.

AU - Tatsumi, K.

PY - 2009/1

Y1 - 2009/1

N2 - Thermal fatigue properties of commercial LF35 (Sn-1.2Ag-0.5Cu-0.05Ni), SAC105 (Sn-1Ag-0.5Cu), and SAC305 (Sn-3Ag-0.5Cu) solders on Casio's wafer-level packages are discussed from the viewpoints of both morphology and grain boundary character. Orientation imaging microscopy revealed that both LF35 and SAC305 resisted the coarsening of tin grains during thermal fatigue as compared with SAC105, correlating with their greater fraction of coincidence site lattice boundaries. This seems to explain why LF35 has superior thermal fatigue life in spite of its lower silver content.

AB - Thermal fatigue properties of commercial LF35 (Sn-1.2Ag-0.5Cu-0.05Ni), SAC105 (Sn-1Ag-0.5Cu), and SAC305 (Sn-3Ag-0.5Cu) solders on Casio's wafer-level packages are discussed from the viewpoints of both morphology and grain boundary character. Orientation imaging microscopy revealed that both LF35 and SAC305 resisted the coarsening of tin grains during thermal fatigue as compared with SAC105, correlating with their greater fraction of coincidence site lattice boundaries. This seems to explain why LF35 has superior thermal fatigue life in spite of its lower silver content.

KW - Grain boundary character distribution

KW - Lead-free solder

KW - Orientation imaging microscopy

KW - Sn-Ag-Cu

KW - Thermal fatigue

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Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character

Abstract

Keywords

ASJC Scopus subject areas

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