Influence of Coil Size and Operating Temperature on the Transient Stability of a Multi-Stacked No-Insulation REBCO Pancake Coil System

Haruka Onoshita, Yuka Yoshihara, Hiroshi Ueda, So Noguchi, Atsushi Ishiyama*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

The no-insulation (NI) coil is a technology expected to realize both high current density and high thermal stability which are essentially trade-off relationship in REBCO coil application. This technique has been studied mainly for application to small-diameter inner coils of NMR magnets exceeding 30 T. In this case, the coil is cooled using 4.2-K liquid He. We are developing an NI-REBCO coil system for high-magnetic-field whole-body MRI, and for a medical cyclotron to be used for cancer therapy. The NI-REBCO coil which we aim for development has a diameter of ∼1 m, a generated magnetic field is ∼10 T, and a conduction cooling around 30 K is assumed. Because the size, operating temperature, and magnetic field differ from those of NMR coil, it is possible that the electromagnetic, thermal, and mechanical behaviors will be quite different. In this paper, we report on these behaviors when a local deterioration occurs in NI-REBCO double-pancake coils using numerical analysis considering coil size, operating temperature, and magnetic field as parameters. For the numerical simulation, we conducted a coupled analysis of current distribution analysis based on PEEC (Partial Element Equivalent Circuit) model and thermal analysis by the 2-dimensional finite element method.

Original languageEnglish
Article number9001187
JournalIEEE Transactions on Applied Superconductivity
Volume30
Issue number4
DOIs
Publication statusPublished - 2020 Jun 1

Keywords

  • Coil stability
  • High-field whole-body MRI
  • Medical cyclotron
  • No-insulation coil
  • REBCO coil

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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