Abstract
A nanoimprint lithography mold was fabricated through electroless deposition combined with self-assembled monolayer (SAM) modification. To copy nanopatterns as "replicates", NiP was electrolessly deposited on a nanopatterned master mold (made of SiO 2/Si), whose surface was modified with 3-[2-(2-aminoethylamino)ethylamino]propyltrimethoxysilane (TAS). NiP deposits were then manually detached from the mold. SAM improves Pd catalyst coverage for electroless deposition, further improving the morphology of the electroless deposition of NiP on the nanopatterned master mold and controlling the adhesion strength between electroless deposited NiP and the nanopatterned master mold to a level appropriate for smooth detachment. The initial catalyzation process and mechanical properties (such as, the hardness and adhesion strength of the SiO 2 substrate) of electroless deposited NiP were also systematically investigated.
Original language | English |
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Pages (from-to) | 75-81 |
Number of pages | 7 |
Journal | Electrochimica Acta |
Volume | 82 |
DOIs | |
Publication status | Published - 2012 Nov 1 |
Keywords
- Adhesion
- Electroless deposition
- Hardness
- Nanoimprint mold
- Self-assembled monolayer
ASJC Scopus subject areas
- Chemical Engineering(all)
- Electrochemistry