Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film

T. Yokoshima*, Y. Yamaji, N. Igawa, Y. Tamura, K. Kikuchi, H. Nakagawa, M. Aoyagi

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Interconnection of multi-pad array was developed by using the electroless CAEx deposition of NiB for application to the new flipchip bonding technology. Behavior of CAEx deposition of Electroless NiB films was depended on pad width and distance between facing pads, and pad with nearer distance and wider pad size was achieved. Practical feasibility of this technique was demonstrated by forming interconnection between pads separated by 5 μm and measuring 5 μm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 μm.

Original languageEnglish
Title of host publicationECS Transactions - Electrodeposition of Nanoengineered Materials and Alloys 2
PublisherElectrochemical Society Inc.
Pages65-74
Number of pages10
Edition28
ISBN (Electronic)9781566776417
ISBN (Print)9781605601991
DOIs
Publication statusPublished - 2007
Externally publishedYes
EventElectrodeposition of Nanoengineered Materials and Alloys 2 - 212th ECS Meeting - Washington, DC, United States
Duration: 2007 Oct 72007 Oct 12

Publication series

NameECS Transactions
Number28
Volume11
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceElectrodeposition of Nanoengineered Materials and Alloys 2 - 212th ECS Meeting
Country/TerritoryUnited States
CityWashington, DC
Period07/10/707/10/12

ASJC Scopus subject areas

  • General Engineering

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