Abstract
Recently, SiC (silicon carbide) has attracted attention as a new material to replace silicon power semiconductors. Since SiC is a wide-bandgap semiconductor and has high heat resistance, it can be operated in a high temperature environment. However, the conventional power module package is mainly joined by a low melting point material such as lead-free solder, and interconnection does not have enough heat resistance. Therefore, we have been proposing and experimenting with Nickel Micro-Plating Bonding (NMPB) using Ni (nickel), which has excellent heat resistance and strong bonding strength, as a new bonding method. Although various researches have been conducted on the bonding reliability of NMPB, long-term reliability evaluated from the aspect of metal fatigue has not been much discussed. In this study, a test has been conducted using a resonant type fatigue testing machine and examined whether acceleration of fatigue evaluation time and long-term reliability of NMPB were confirmed.
| Original language | English |
|---|---|
| Pages (from-to) | 1-8 |
| Number of pages | 8 |
| Journal | Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society |
| Volume | 40 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2022 |
Keywords
- High heat resistance
- Interconnection
- Long-term reliability
- Micro-plating
- Nickel
- Silicon carbide
ASJC Scopus subject areas
- Mechanics of Materials
- Mechanical Engineering
- Surfaces, Coatings and Films
- Metals and Alloys