@inproceedings{8f80d340e5784545933309f9fdd10432,
title = "Low crosstalk and high modulation bandwidth 100GbE optical transmitter using flip-chip interconnects",
abstract = "We developed the first compact 100GbE optical transmitter to use flip-chip interconnects for the first time. The flip-chip interconnects provide low crosstalk and a high modulation bandwidth. Under four-channel simultaneous operation, the 100GBASE-LR4 mask margin of the flip-chip interconnection module was improved by 10% to 27% compared with that of a wire interconnection module.",
keywords = "100 Gigabit Ethernet, DFB laser, EADFB laser array, EAM, Photonic integrated circuits, flip-chip",
author = "Shigeru Kanazawa and Takeshi Fujisawa and Kiyoto Takahata and Akira Ohki and Ryuzo Iga and Hiroyuki Ishii",
year = "2013",
doi = "10.1109/ICIPRM.2013.6562619",
language = "English",
isbn = "9781467361309",
series = "Conference Proceedings - International Conference on Indium Phosphide and Related Materials",
booktitle = "2013 International Conference on Indium Phosphide and Related Materials, IPRM 2013",
note = "2013 25th International Conference on Indium Phosphide and Related Materials, IPRM 2013 ; Conference date: 19-05-2013 Through 23-05-2013",
}