Low-temperature anodic bonding using lithium aluminosilicate-β-quartz glass ceramic

Shuichi Shoji*, Hiroto Kikuchi, Hirotaka Torigoe

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

24 Citations (Scopus)


Silicon-to-glass anodic bonding is performed at temperatures below 180°C using lithium aluminosilicate-β-quartz glass ceramic. High alkaline ion mobility at low temperature, which is required for bonding, and thermal expansion coefficient matching to Si are realized by controlling the composition of the glass ceramic. Bonding is obtained at a lowest temperature of 140°C. Useful bonding conditions are temperature above 160°C (applied voltage above 500 V). Since the etch rate of the glass ceramic is five times higher than that of Pyrex glass in HF wet etching and the undercut is very small with a Cr-Au etch mask, three-dimensional structures are easily fabricated. Low-temperature anodic bonding using this type of glass ceramic is useful for the packaging and assembling of MEMS.

Original languageEnglish
Pages (from-to)95-100
Number of pages6
JournalSensors and Actuators, A: Physical
Issue number1
Publication statusPublished - 1998 Jan 1


  • Anodic bonding
  • Glass ceramic
  • Low-temperature bonding
  • Micro assembly
  • Micro package

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering


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