TY - JOUR
T1 - Low-temperature anodic bonding using lithium aluminosilicate-β-quartz glass ceramic
AU - Shoji, Shuichi
AU - Kikuchi, Hiroto
AU - Torigoe, Hirotaka
N1 - Funding Information:
The authors are grateful to HOYA Co. for supplying the new glass ceramics and SD-2 glass. We thank Mr T. Seki-guchi for his help in the measurement of the glass etching. Our work is partly supported by the Japanese Ministry of Education Science and Culture under a Grant-in-Aid for Scientific Research (C) No. 076505 13.
PY - 1998/1/1
Y1 - 1998/1/1
N2 - Silicon-to-glass anodic bonding is performed at temperatures below 180°C using lithium aluminosilicate-β-quartz glass ceramic. High alkaline ion mobility at low temperature, which is required for bonding, and thermal expansion coefficient matching to Si are realized by controlling the composition of the glass ceramic. Bonding is obtained at a lowest temperature of 140°C. Useful bonding conditions are temperature above 160°C (applied voltage above 500 V). Since the etch rate of the glass ceramic is five times higher than that of Pyrex glass in HF wet etching and the undercut is very small with a Cr-Au etch mask, three-dimensional structures are easily fabricated. Low-temperature anodic bonding using this type of glass ceramic is useful for the packaging and assembling of MEMS.
AB - Silicon-to-glass anodic bonding is performed at temperatures below 180°C using lithium aluminosilicate-β-quartz glass ceramic. High alkaline ion mobility at low temperature, which is required for bonding, and thermal expansion coefficient matching to Si are realized by controlling the composition of the glass ceramic. Bonding is obtained at a lowest temperature of 140°C. Useful bonding conditions are temperature above 160°C (applied voltage above 500 V). Since the etch rate of the glass ceramic is five times higher than that of Pyrex glass in HF wet etching and the undercut is very small with a Cr-Au etch mask, three-dimensional structures are easily fabricated. Low-temperature anodic bonding using this type of glass ceramic is useful for the packaging and assembling of MEMS.
KW - Anodic bonding
KW - Glass ceramic
KW - Low-temperature bonding
KW - Micro assembly
KW - Micro package
UR - http://www.scopus.com/inward/record.url?scp=0031648043&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0031648043&partnerID=8YFLogxK
U2 - 10.1016/S0924-4247(97)01659-2
DO - 10.1016/S0924-4247(97)01659-2
M3 - Article
AN - SCOPUS:0031648043
SN - 0924-4247
VL - 64
SP - 95
EP - 100
JO - Sensors and Actuators A: Physical
JF - Sensors and Actuators A: Physical
IS - 1
ER -