Low temperature bonding process using mixed Cu-Ag nanoparticles for electronic packaging

Guisheng Zou*, Jianfeng Yan, Xiaoyu Wang, Fengwen Mu, Hailin Bai, Aiping Wu, Anming Hu, Y. Norman Zhou

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Engineering & Materials Science

Chemical Compounds