Low-temperature direct bonding of poly(methyl methacrylate) for polymer microchips

Hidetoshi Shinohara*, Jun Mizuno, Shuichi Shoji

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

39 Citations (Scopus)


A low-temperature, direct bonding method for poly(methyl methacrylate) (PMMA) plates has been developed by employing surface treatment by atmospheric pressure oxygen plasma, vacuum oxygen plasma, ultraviolet (UV)/ozone or vacuum ultraviolet (VUV)/ozone. Reasonable bonding strength, as evaluated by a tensile test, was achieved below the glass transition temperature (Tg). The highest bonding strength among the achieved results is 1.43 MPa (about three times the value for conventional direct bonding) at an annealing temperature of 50°C and an applied pressure of 2.5 MPa for 10 min. Low-temperature bonding prevents deformation of the PMMA microstructure. A prototype PMMA microchip that has fine channels of 5μm depth was fabricated by hot-embossing using a Si mold. After atmospheric pressure oxygen plasma activation, direct bonding was carried out at an annealing temperature of 75°C and an applied pressure of 3 MPa for 3 min. The method gives good bonding characteristics without deformation and leakage. This low-temperature bonding technology can be applied to polymer micro/nano structures.

Original languageEnglish
Pages (from-to)301-306
Number of pages6
JournalIEEJ Transactions on Electrical and Electronic Engineering
Issue number3
Publication statusPublished - 2007 May


  • Direct bonding
  • Hot-embossing
  • Oxygen plasma
  • PMMA microchip
  • Ultraviolet light
  • Vacuum ultraviolet light

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


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