Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Weixin Fu; Hiroyuki Kuwae; Bo Ma; Shuichi Shoji; Jun Mizuno

doi:10.23919/ICEP.2017.7939349

Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Weixin Fu, Hiroyuki Kuwae, Bo Ma, Shuichi Shoji, Jun Mizuno

Research Organization for Nano & Life Innovation

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O₃) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.

Original language	English
Title of host publication	2017 International Conference on Electronics Packaging, ICEP 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	167-170
Number of pages	4
ISBN (Electronic)	9784990218836
DOIs	https://doi.org/10.23919/ICEP.2017.7939349
Publication status	Published - 2017 Jun 5
Event	2017 International Conference on Electronics Packaging, ICEP 2017 - Tendo, Yamagata, Japan Duration: 2017 Apr 19 → 2017 Apr 22

Other

Other	2017 International Conference on Electronics Packaging, ICEP 2017
Country/Territory	Japan
City	Tendo, Yamagata
Period	17/4/19 → 17/4/22

Keywords

direct bonding
low temperature bonding
polyoxymethylene
self-assembled monolayer
VUV

ASJC Scopus subject areas

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.23919/ICEP.2017.7939349

Cite this

Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). / Fu, Weixin; Kuwae, Hiroyuki; Ma, Bo et al.
2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 167-170 7939349.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Fu, W, Kuwae, H, Ma, B, Shoji, S & Mizuno, J 2017, Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM). in 2017 International Conference on Electronics Packaging, ICEP 2017., 7939349, Institute of Electrical and Electronics Engineers Inc., pp. 167-170, 2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Yamagata, Japan, 17/4/19. https://doi.org/10.23919/ICEP.2017.7939349

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abstract = "Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.",

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AU - Mizuno, Jun

PY - 2017/6/5

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N2 - Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.

AB - Direct bonding of polyoxymethylene (POM) at 100 °C was feasible using self-assembly monolayers (SAM). The POM substrates were first activated by vacuum ultraviolet irradiation in presence of oxygen gas (VUV/O3) and then modified with SAM: (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS), respectively. Fourier transform infrared spectroscopy showed that both APTES and GOPTS modifications were successful. The bonding reached an average bonding strength of 0.37 MPa, and bulk fracture was observed after the debonding test. Surface observation results showed VUV activation process time played an important role in bonding. This technology is expected to be applied in future bio-inert electron devices.

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Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Abstract

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Keywords

ASJC Scopus subject areas

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