TY - JOUR
T1 - Low-temperature direct heterogeneous bonding of polyether ether ketone and platinum
AU - Fu, Weixin
AU - Shigetou, Akitsu
AU - Shoji, Shuichi
AU - Mizuno, Jun
N1 - Funding Information:
The authors acknowledge the following organizations for supporting this work: 1) Japan Ministry of Education, Culture, Sports, Science and Technology (MEXT) Grant-in-Aid for Scientific Basic Research (A) No. 16H02349; 2) Grant-in-Aid for Cooperative Research Project Nationwide Joint-Use Research Institute on Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials from MEXT; and 3) a Grant-in-Aid for Scientific Basic Research (B) No 26289112. This work is also partly supported by JSPS KAKENHI Grant Number 25289241. The authors also wish to acknowledge the support provided by the MEXT Nanotechnology Platform Support Project of Waseda University. And the author W. Fu also acknowledges the Leading Graduate Program in Science and Engineering, Waseda University from MEXT, Japan.
Publisher Copyright:
© 2017 Elsevier B.V.
PY - 2017/10/1
Y1 - 2017/10/1
N2 - Direct heterogeneous bonding between polyether ether ketone (PEEK) and Pt was realized at the temperatures lower than 150 °C. In order to create sufficient bondability to diverse materials, the surface was modified by vacuum ultraviolet (VUV) irradiation, which formed hydrate bridges. For comparison, direct bonding between surfaces atomically cleaned via Ar fast atom bombardment (FAB) was conducted in a vacuum. The VUV irradiation was found to be effective for creating an ultrathin hydrate bridge layer from the residual water molecules in the chamber. Tight bonds were formed through dehydration of the hydrate bridges by heating at 150 °C, which also contributed to enhancing interdiffusion across the interface. The VUV-modified surfaces showed bondability as good as that of the FAB-treated surfaces, and the VUV-modified samples had shear strengths at the same level as those of FAB-treated surfaces. This technology will be of practical use in the packaging of lightweight, flexible biomedical devices.
AB - Direct heterogeneous bonding between polyether ether ketone (PEEK) and Pt was realized at the temperatures lower than 150 °C. In order to create sufficient bondability to diverse materials, the surface was modified by vacuum ultraviolet (VUV) irradiation, which formed hydrate bridges. For comparison, direct bonding between surfaces atomically cleaned via Ar fast atom bombardment (FAB) was conducted in a vacuum. The VUV irradiation was found to be effective for creating an ultrathin hydrate bridge layer from the residual water molecules in the chamber. Tight bonds were formed through dehydration of the hydrate bridges by heating at 150 °C, which also contributed to enhancing interdiffusion across the interface. The VUV-modified surfaces showed bondability as good as that of the FAB-treated surfaces, and the VUV-modified samples had shear strengths at the same level as those of FAB-treated surfaces. This technology will be of practical use in the packaging of lightweight, flexible biomedical devices.
KW - Heterogeneous bonding
KW - Hydrate bridge layer
KW - Low temperature
KW - Peek
KW - Surface modification
KW - VUV
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U2 - 10.1016/j.msec.2017.05.058
DO - 10.1016/j.msec.2017.05.058
M3 - Article
C2 - 28629090
AN - SCOPUS:85019855510
SN - 0928-4931
VL - 79
SP - 860
EP - 865
JO - Materials Science and Engineering C
JF - Materials Science and Engineering C
ER -