Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects

Hayata Mimatsu; Jun Mizuno; Takashi Kasahara; Mikiko Saito; Shuichi Shoji; Hiroshi Nishikawa

doi:10.1109/MEMSYS.2014.6765845

Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects

Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Shuichi Shoji, Hiroshi Nishikawa

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Citations (Scopus)

Abstract

We proposed low-temperature Au-Au bump interconnects bonding using nanoporous Au-Ag powders as a connective adhesion. The nanoporous powders were formed by de-alloying Au-Ag alloy in HNO₃ solution. To optimize the pore size, the influence of the annealing temperature on the porous structures was investigated. Selective transfer of the nanoporous powders on bumps was obtained by stamping process. Bonding strength of about 2.4 MPa was achieved at 150°C by using nanoporous Au-Ag powders. Bonding interface was evaluated by scanning acoustic microscope and scanning electron microscopy. This result indicated that the nanoporous powder is a useful material for low-temperature Au-Au bonding.

Original language	English
Title of host publication	MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1131-1134
Number of pages	4
ISBN (Print)	9781479935086
DOIs	https://doi.org/10.1109/MEMSYS.2014.6765845
Publication status	Published - 2014
Event	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 - San Francisco, CA, United States Duration: 2014 Jan 26 → 2014 Jan 30

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Country/Territory	United States
City	San Francisco, CA
Period	14/1/26 → 14/1/30

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

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10.1109/MEMSYS.2014.6765845

Cite this

Mimatsu, H., Mizuno, J., Kasahara, T., Saito, M., Shoji, S., & Nishikawa, H. (2014). Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects. In MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems (pp. 1131-1134). [6765845] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2014.6765845

Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects. / Mimatsu, Hayata; Mizuno, Jun; Kasahara, Takashi et al.
MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2014. p. 1131-1134 6765845 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Mimatsu, H, Mizuno, J, Kasahara, T, Saito, M, Shoji, S & Nishikawa, H 2014, Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects. in MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems., 6765845, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Institute of Electrical and Electronics Engineers Inc., pp. 1131-1134, 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014, San Francisco, CA, United States, 14/1/26. https://doi.org/10.1109/MEMSYS.2014.6765845

Mimatsu H, Mizuno J, Kasahara T, Saito M, Shoji S, Nishikawa H. Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects. In MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc. 2014. p. 1131-1134. 6765845. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2014.6765845

Mimatsu, Hayata ; Mizuno, Jun ; Kasahara, Takashi et al. / Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects. MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 1131-1134 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

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abstract = "We proposed low-temperature Au-Au bump interconnects bonding using nanoporous Au-Ag powders as a connective adhesion. The nanoporous powders were formed by de-alloying Au-Ag alloy in HNO3 solution. To optimize the pore size, the influence of the annealing temperature on the porous structures was investigated. Selective transfer of the nanoporous powders on bumps was obtained by stamping process. Bonding strength of about 2.4 MPa was achieved at 150°C by using nanoporous Au-Ag powders. Bonding interface was evaluated by scanning acoustic microscope and scanning electron microscopy. This result indicated that the nanoporous powder is a useful material for low-temperature Au-Au bonding.",

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AB - We proposed low-temperature Au-Au bump interconnects bonding using nanoporous Au-Ag powders as a connective adhesion. The nanoporous powders were formed by de-alloying Au-Ag alloy in HNO3 solution. To optimize the pore size, the influence of the annealing temperature on the porous structures was investigated. Selective transfer of the nanoporous powders on bumps was obtained by stamping process. Bonding strength of about 2.4 MPa was achieved at 150°C by using nanoporous Au-Ag powders. Bonding interface was evaluated by scanning acoustic microscope and scanning electron microscopy. This result indicated that the nanoporous powder is a useful material for low-temperature Au-Au bonding.

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Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects

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