Low-temperature poly(oxymethylene) direct bonding via self-assembled monolayer

Weixin Fu*, Bo Ma, Hiroyuki Kuwae, Shuichi Shoji, Jun Mizuno

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


A direct bonding of poly(oxymethylene) (POM) was feasible at 100 °C by using self-assembled monolayer (SAM) as a surface modification method. (3-aminopropyl)triethoxysilane (APTES) and (3-glycidyloxypropyl)trimethoxysilane (GOPTS) were used in our work. X-ray photoelectron spectroscopy showed that both APTES and GOPTS modified the POM surface successfully. Bonding strength evaluation revealed that surface modification was affected by pretreatment (VUV/O3) process time. In addition, the bonding condition with highest strength had an average strength of 372 kPa. This technology is expected to be used in packaging for micro-/nano-electromechanical systems, such as biomedical devices.

Original languageEnglish
Article number02BB01
JournalJapanese journal of applied physics
Issue number2
Publication statusPublished - 2018 Feb

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)


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