Abstract
The micro-scaled Ag2O paste is cheaper than Ag nanoparticle paste and has a promising application prospect in high temperature electronic packaging industry. In order to further reduce the cost and improve the joint ability of the resistance to electrochemical migration (ECM), the Ag-coated Cu particles were added into the original micro-scaled Ag2O paste to make a new composite paste. In this paper, the shear strength of joints obtained by using the original Ag2O paste and the new Ag2O paste contained Ag-coated Cu particles and the two sintered pastes' ability of resistance to ECM were compared. The results revealed that the average shear strength of joints obtained by using the new Ag2O paste with Ag-coated copper at the typical bonding condition (250°C, 5 min, 2 MPa) showed an obvious decrease, while the ability of the resistance to ECM got a significant increase due to the addition of Ag-coated Cu particles.
| Original language | English |
|---|---|
| Pages (from-to) | 15-18 |
| Number of pages | 4 |
| Journal | Hanjie Xuebao/Transactions of the China Welding Institution |
| Volume | 35 |
| Issue number | 2 |
| Publication status | Published - 2014 Jan 1 |
| Externally published | Yes |
Keywords
- Ag-coated Cu particles
- Electrochemical migration (ECM)
- Electronic packaging
ASJC Scopus subject areas
- Mechanical Engineering
- Mechanics of Materials