Abstract
LSI on-chip optical interconnections are discussed from the viewpoint of a comparison between optical and electrical interconnections. Based on a practical prediction of our optical device development, optical interconnects will have an advantage over electrical interconnects within a chip that has an interconnect lengthless than about 10mm at the hp32-22nm technology node. Fundamental optical devices and components used in interconnections have also been introduced that are small enough to be placed on top of a Si LSI and that can be fabricated using methodsc ompatible with CMOS processes. A SiON waveguide showed a low propagation loss around 0 .3dB/cm at a wavelength of 850nm, and excellent branching characteristics were achieved for MMI (multimode interference) branch structures. A Si nano-photodiodse howed highly enhanced speed and efficiency with a surface plasmon antenna. By combining our Si nano-photonic devices with the advanced TIA-less optical clock distribution circuits, clock distribution above 10GHz can be achieved with a small footprint on an LSI chip.
Original language | English |
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Pages (from-to) | 131-137 |
Number of pages | 7 |
Journal | IEICE Transactions on Electronics |
Volume | E91-C |
Issue number | 2 |
DOIs | |
Publication status | Published - 2008 Feb |
Externally published | Yes |
Keywords
- LSI
- Optical interconnect
- Si nano-photodiode
- Si nano-photonics
- SiON waveguide
- Surface plasmon antenna
- TIA-less optical clock circuit
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering