LSI on-chip optical interconnection with Si nano-photonics

Junichi Fujikata*, Kenichi Nishi, Akiko Gomyo, Jun Ushida, Tsutomu Ishi, Hiroaki Yukawa, Daisuke Okamoto, Masafumi Nakada, Takanori Shimizu, Masao Kinoshita, Koichi Nose, Masayuki Mizuno, Tai Tsuchizawa, Toshifumi Watanabe, Koji Yamada, Seiichi Itabashi, Keishi Ohashi

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

24 Citations (Scopus)


LSI on-chip optical interconnections are discussed from the viewpoint of a comparison between optical and electrical interconnections. Based on a practical prediction of our optical device development, optical interconnects will have an advantage over electrical interconnects within a chip that has an interconnect lengthless than about 10mm at the hp32-22nm technology node. Fundamental optical devices and components used in interconnections have also been introduced that are small enough to be placed on top of a Si LSI and that can be fabricated using methodsc ompatible with CMOS processes. A SiON waveguide showed a low propagation loss around 0 .3dB/cm at a wavelength of 850nm, and excellent branching characteristics were achieved for MMI (multimode interference) branch structures. A Si nano-photodiodse howed highly enhanced speed and efficiency with a surface plasmon antenna. By combining our Si nano-photonic devices with the advanced TIA-less optical clock distribution circuits, clock distribution above 10GHz can be achieved with a small footprint on an LSI chip.

Original languageEnglish
Pages (from-to)131-137
Number of pages7
JournalIEICE Transactions on Electronics
Issue number2
Publication statusPublished - 2008 Feb
Externally publishedYes


  • LSI
  • Optical interconnect
  • Si nano-photodiode
  • Si nano-photonics
  • SiON waveguide
  • Surface plasmon antenna
  • TIA-less optical clock circuit

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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